Accessories

Image Part Number Description / PDF Quantity Rfq
M68TC08GR8P28E

M68TC08GR8P28E

NXP Semiconductors

ADAPTER TARGET HEAD

0

CWH-GTT-ARKT-YE

CWH-GTT-ARKT-YE

NXP Semiconductors

KIT UPG GIGABITTAP+TRC

0

M68TC08GZP28E

M68TC08GZP28E

NXP Semiconductors

ADAPTER TARGET HEAD

0

M68TQP044SA1E

M68TQP044SA1E

NXP Semiconductors

HARDWARE CSIC 44-QFP

0

PQ-MDS-USB

PQ-MDS-USB

NXP Semiconductors

PMC CARD USB

0

M68TC08JL3P28E

M68TC08JL3P28E

NXP Semiconductors

ADAPTER TARGET HEAD

0

SCEBLINGEN

SCEBLINGEN

NXP Semiconductors

PC TO LINEAR CONTROL INTERFACE

0

M68TQS032SAN1E

M68TQS032SAN1E

NXP Semiconductors

HARDWARE CSIC-32-QFP SOCKET

0

M68TC08AX48FU64E

M68TC08AX48FU64E

NXP Semiconductors

ADAPTER TARGET X68TC08AX48FU64

0

MXC9LCDDIS-AB

MXC9LCDDIS-AB

NXP Semiconductors

BOARD LCD

0

DSPB725DB2E

DSPB725DB2E

NXP Semiconductors

DAUGHTER CARD C VERSION

0

CWH-CTS-HWFLY-YE

CWH-CTS-HWFLY-YE

NXP Semiconductors

KIT HW ADAPTER HWIC W/FLYI

0

LFSTBBAT9

LFSTBBAT9

NXP Semiconductors

BOARD ACCELEROMETER 9V BATTERY

0

M68CBL05B

M68CBL05B

NXP Semiconductors

TARGET CBL FLEX B MMEVS/MMDS-MCU

0

CWH-ETP-ONCE-YE

CWH-ETP-ONCE-YE

NXP Semiconductors

KIT ETHERNET TAP PROBE TIP ONCE

0

M68TC08MR8P28E

M68TC08MR8P28E

NXP Semiconductors

ADAPTER TARGET HEAD HC908MR8

0

M68TC08GZFA48

M68TC08GZFA48

NXP Semiconductors

TARGET HEAD ADAPTER

0

M68TE08LJLKFQ80E

M68TE08LJLKFQ80E

NXP Semiconductors

ADAPTER TARGET HEAD

0

M68TQS044SAG1E

M68TQS044SAG1E

NXP Semiconductors

HARDWARE CSIC MCU 44-QFP SOCKET

0

OM11018

OM11018

NXP Semiconductors

DISPLAY QVGA TFT

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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