Accessories

Image Part Number Description / PDF Quantity Rfq
180-0091

180-0091

Digi

COVER DUST OP7200

0

101-0465

101-0465

Digi

MODULE LCD/KEYPAD PLUG IN

0

20-101-0215

20-101-0215

Digi

MOD CTLR PROGR BL1710 16IN 16OUT

0

151-0127

151-0127

Digi

ADAPTER BOARD 2MM PITCH

0

101-0486

101-0486

Digi

CARD CPU ETHERNET SR9150 SMRTSTR

0

20-101-0467

20-101-0467

Digi

FLASH MEMORY EXPANSION 8MB 1024

0

101-0627

101-0627

Digi

KIT TOOL FOR BL2600 INTL

0

101-0514

101-0514

Digi

SCREW TERMINL WIRING 27POS FWT27

0

101-0318

101-0318

Digi

MCU PWR SUPPLY 24V 1.1A W/CBL

0

101-0427

101-0427

Digi

KIT TOOL FOR SR9000 SMARTSTAR

0

20-101-0148

20-101-0148

Digi

BOARD DEMO Z-WORLD

0

20-101-1236

20-101-1236

Digi

INTERFACE BOARD RCM5700

0

101-0669

101-0669

Digi

BOOK DYNAMIC C DOC BUNDLE

0

101-0585

101-0585

Digi

KIT TOOL FOR EM1500

0

CC-ACC-MB02945

CC-ACC-MB02945

Digi

CONN FOR 9P 9215 AND WI-9P 9215

0

20-101-0392

20-101-0392

Digi

CARD A/D SMART STAR 0-10V SR9300

0

76000663

76000663

Digi

KIT EVAL RJ-45/DB-XX

0

101-0417

101-0417

Digi

BOARD RABBITLINK EG2100 NETWORK

0

20-101-0420

20-101-0420

Digi

TERMINAL FLD WIRING 27POS FWT27

0

101-0420

101-0420

Digi

PLUG TERMINAL WIRING 27POS FWT27

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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