Accessories

Image Part Number Description / PDF Quantity Rfq
101-0815

101-0815

Digi

CARD CPU SR9100 512K SRAM

0

101-1301

101-1301

Digi

DEV ACCESSORY

0

101-0686

101-0686

Digi

POWER SUPPLY 12VDC/110 5MM

0

20-101-0580

20-101-0580

Digi

CARD RABBITLINK REMOTE EG2110

0

101-0410

101-0410

Digi

BOARD BATTERY FOR OP6700/6600

0

20-101-0487

20-101-0487

Digi

BACKPLANE CHASSIS 4SLOT SR9050

0

101-0487

101-0487

Digi

BACKPLANE 3-SLT SR9050 SMARTSTAR

0

20-101-0445

20-101-0445

Digi

CARD D/A 4-20MA SR9420 SMARTSTAR

0

151-0153

151-0153

Digi

ASSEMBLY - RABBITFLEX CABLES

0

101-0589

101-0589

Digi

CLONING BOARD RABBIT

0

101-0668

101-0668

Digi

BOOK TCP/IP DOCUMENTATION

0

101-0409-55

101-0409-55

Digi

BOARD BATTERY FOR SR9100

0

101-0306

101-0306

Digi

KIT TOOL FOR OP7100

0

FS-267

FS-267

Digi

ADAPTER JTAG ELAN486/386DRAM

0

101-0009-55

101-0009-55

Digi

KIT DC PLC CABLE

0

20-101-0216

20-101-0216

Digi

MOD CTLR PROGR BL1720 16IN 16OUT

0

20-101-0069

20-101-0069

Digi

XP8300 EXP BRD

0

20-101-0466

20-101-0466

Digi

KEYPAD/DISPLAY UNIT WITH CASE

0

101-0545

101-0545

Digi

PROTOTYPING BOARD FOR LP3500

0

101-1015

101-1015

Digi

RCM3400 BGA1

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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