Accessories

Image Part Number Description / PDF Quantity Rfq
PKG-DINRAIL-KIT

PKG-DINRAIL-KIT

Digi

KIT DINRAIL MT XSTREAM/TEND/CITE

0

20-101-0514

20-101-0514

Digi

TERM FIELD WIRING 27-POS FWT27

0

20-101-0738

20-101-0738

Digi

CARD ETHERNET CPU 512K SR9150

0

20-101-1198

20-101-1198

Digi

CARD EXPANSION RN1400 ROHS

0

101-0466

101-0466

Digi

KEYPAD DISPLAY UNIT WITH CASE

0

20-101-0515

20-101-0515

Digi

TERM FIELD WIRING 18-POS FWT18R

0

20-101-0390

20-101-0390

Digi

CARD DIGITIAL I/O 8/16 SR9210

0

20-101-0389

20-101-0389

Digi

CARD DIGITAL I/O 16/8 SR9200

0

20-101-0495

20-101-0495

Digi

BASEPLATE BLK PLASTIC W/SCREWS

0

101-0437

101-0437

Digi

CARD DGTL IO 16/8 SOURCNG SR9205

0

151-0096

151-0096

Digi

KIT ACCY RCM30/31/32XX

0

101-0580

101-0580

Digi

BOARD RABBITLINK EG2110 NETWORK

0

20-101-0089

20-101-0089

Digi

CONTROL EC PK2230

0

20-101-0512

20-101-0512

Digi

BACKPLANE CHASSIS 7-SLOT SR9010

0

20-101-0581

20-101-0581

Digi

CONNECTIVITY KIT BL2600 INTERFCE

0

151-0113

151-0113

Digi

CONN ADAPTER BOARD 2MM TO .100"

0

101-0513

101-0513

Digi

CABLE PROGRAMMING RS232

0

151-0107

151-0107

Digi

KIT ACCY RCM3400 PROTO

0

20-101-1200

20-101-1200

Digi

EXPAN BRD W4RELAYS SPST

0

101-1123

101-1123

Digi

USB PROGRAM CABLE

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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