Accessories

Image Part Number Description / PDF Quantity Rfq
181-0036

181-0036

Digi

OVERLAY PANEL OP6800

0

101-0624

101-0624

Digi

KIT TOOL FOR EG2110

0

101-0391

101-0391

Digi

CARD DIGITAL IO 8/8 SNKNG SR9220

0

101-0433

101-0433

Digi

BOARD PROTOTYPING FOR RCM2100

0

20-101-0545

20-101-0545

Digi

PROTOTYPING BOARD FOR LP3500

0

DG-ACC-TTL2S

DG-ACC-TTL2S

Digi

KIT JUMPSTART TTL-SRL ADAPTER

0

540-0069

540-0069

Digi

KEYPAD DISPLAY UNIT CABLE 5"

0

101-0879

101-0879

Digi

RABBITNET KDIF RN1600

0

540-0070

540-0070

Digi

CABLE CONVERTER RS-232 TO USB

0

101-0440

101-0440

Digi

CARD 8-RELAYS SR9510 SMARTSTAR

0

695-0023

695-0023

Digi

PROM FOR BL2500

0

101-0021

101-0021

Digi

BOARD EXP A/D12

0

175-0254

175-0254

Digi

ADAPTER BOARD RCM30/31/32/34XX

0

101-0738

101-0738

Digi

CARD ETHERNET 512K SRAM SR9150

0

101-1302

101-1302

Digi

DEV ACCESSORY

0

20-101-0504

20-101-0504

Digi

ACCY CABLE&MOUNTING HDWR SR9050

0

101-0617

101-0617

Digi

CARD RELAY EXPANSION RN1400

0

180-0088

180-0088

Digi

PANEL TOP OP6800/KDU

0

20-101-1289

20-101-1289

Digi

DEV ACCESSORY

0

CC-ACC-UART

CC-ACC-UART

Digi

KIT UART APPLICATION

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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