Accessories

Image Part Number Description / PDF Quantity Rfq
MAXPOWERTOOL002#

MAXPOWERTOOL002#

Maxim Integrated

DONGLE USB-TO-PMBUS

2680

MA320206

MA320206

Roving Networks / Microchip Technology

ATSAMC21 MOTOR CONTROL PLUG IN M

0

MIKROE-322

MIKROE-322

MikroElektronika

BOARD TOUCHPANEL CONNECTOR

0

FCB-3020-SMT

FCB-3020-SMT

Terasic

DE3 TO DE3 HSTC CABLE

0

ADCRF2LA/NOPB

ADCRF2LA/NOPB

Texas Instruments

BOARD ADAPTER

3

290-022

290-022

Digilent, Inc.

STICKY RUBBER WHEELS PAIR

1

PRT-17907

PRT-17907

SparkFun

RASPBERRY PI PICO HEADERS KIT

199

114090054

114090054

Seeed

INTELLIGENT ROBOT REMOTE CONTROL

0

X15FANKIT

X15FANKIT

FAN 5V FOR BEAGLEBRD W/CONNECTOR

115

MA330014

MA330014

Roving Networks / Microchip Technology

MODULE DSPIC33 28P-100P QFP MC

0

3894

3894

Adafruit

JST PH 3PIN TO FEMALE SOCKET CAB

418

CY3250-27XXXQFN-POD

CY3250-27XXXQFN-POD

IR (Infineon Technologies)

EVAL KITS/TOOLS

0

HSC-ADC-FIFO5-INTZ

HSC-ADC-FIFO5-INTZ

Analog Devices, Inc.

INTERPOSER FOR QUAD/OCTAL ADC

3

3557

3557

Adafruit

RIGHT ANGLE (R BEND) MICRO HDMI

255

EVAL-FW-HPSK2

EVAL-FW-HPSK2

Analog Devices, Inc.

EVAL BOARD HPSK2

3

20-101-0688

20-101-0688

Digi

CARD D/A EXPANSION RN1300

27

MA330013

MA330013

Roving Networks / Microchip Technology

MODULE PLUG-IN DSPIC33 100TQFP

3

THSER101

THSER101

THine Solutions

CABLE EXTENDER FOR RASPBERRY PI

0

2571

2571

Adafruit

50-PIN FPC EXTENSION BOARD CABLE

0

MA160015

MA160015

Roving Networks / Microchip Technology

MODULE PLUG-IN PIC16LF1947

5

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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