Accessories

Image Part Number Description / PDF Quantity Rfq
4556

4556

Adafruit

DIN ADAPTER - ARDUINO UNO

11

STM32103B-D/RAIS

STM32103B-D/RAIS

STMicroelectronics

KIT DEVELOPMENT FOR STM32

0

MA180019

MA180019

Roving Networks / Microchip Technology

MODULE PLUG-IN PICDEM LCD2

0

MIKROE-1766

MIKROE-1766

MikroElektronika

FLAT CBL IDC10 1.27MM CONNECTOR

160

VA800A-SPI

VA800A-SPI

Bridgetek

MODULE USB 2.0 TO MPSSE SPI

60

10115

10115

Phase Dock Inc.

2X4 ELECTRONICS MOUNTING CONNECT

25

2143

2143

Adafruit

RASPBERRY PI CAMERA CABLE 1M

26

MX50EBOOKDC1

MX50EBOOKDC1

NXP Semiconductors

HARDWARE MX50EBOOKDC1

2

PCM16XT0

PCM16XT0

Roving Networks / Microchip Technology

PROCESSOR MODULE PIC16C925/926

4

UP-BACKPLANE-01-EK

UP-BACKPLANE-01-EK

Silicon Labs

UDP BACKPLANE

0

ATSMARTCARD-XPRO

ATSMARTCARD-XPRO

Roving Networks / Microchip Technology

KIT EXTENSION XPLAINED PRO

0

LDCCOILEVM

LDCCOILEVM

Texas Instruments

EVAL MOD REFERENCE COIL BOARD

37

CY3250-68QFN-FK

CY3250-68QFN-FK

IR (Infineon Technologies)

REPLACEMENT ICE PODS (4) 28-SSOP

5

240-021-12

240-021-12

Digilent, Inc.

CABLE CONNECTOR 6PIN 12"

0

MOD-RS232

MOD-RS232

Olimex

UEXT ADAPTER MODULE RS232

7

ADM00861

ADM00861

Roving Networks / Microchip Technology

230VAC LED LOAD BOARD

3

PRT-15109

PRT-15109

SparkFun

QWIIC CABLE - GROVE ADAPTER (150

104

MA330037

MA330037

Roving Networks / Microchip Technology

DSPIC33EP512GM710 L PIM MODULE

4

GEN4-IB

GEN4-IB

4D Systems

INTERFACE BOARD FOR GEN4 INTELLI

17

AC320006

AC320006

Roving Networks / Microchip Technology

KIT STARTER ADAPT BD PIC32MZ EC

9

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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