Accessories

Image Part Number Description / PDF Quantity Rfq
HW-USB-FLYLEADS-G

HW-USB-FLYLEADS-G

Xilinx

BOARD ADAPTER AND FLY LEADS

50

SEN-16778

SEN-16778

SparkFun

OPENMV ULTRA WIDE ANGLE LENS

19

ESP-FactoryTB1

ESP-FactoryTB1

Espressif Systems

PRODUCTION TESTING BOARD WITH TW

0

1116

1116

Adafruit

BOARD EDGE MOUNTING KIT 4PACK

0

DWG0003

DWG0003

DFRobot

ACRYLIC UNO BASE

0

MA330041-1

MA330041-1

Roving Networks / Microchip Technology

DSPIC33CK256MP508 EXTERNAL OPAMP

16

750-00001

750-00001

Parallax, Inc.

USB MAINS ADAPTER, 18W, 5V, 3A

50

MIKROE-499

MIKROE-499

MikroElektronika

BOOK PIC MCU ROGRAMMING BASIC

0

PTC04-DB-8X91804

PTC04-DB-8X91804

Melexis

PTC04 DAUGHTERBOARD 91804

4

CY3210-28XXX

CY3210-28XXX

IR (Infineon Technologies)

APPLICATION PROCESSOR AND SOC

0

ADUX1020-EVALZ-LED

ADUX1020-EVALZ-LED

Analog Devices, Inc.

LED ADD-ON BOARD

0

EA-ACC-040

EA-ACC-040

Embedded Artists

JTAG ADAPTER 10-PIN TO 20-PIN

0

310-100

310-100

Digilent, Inc.

ANALOG DISCOVERY 2X15 CABLE

64

FIT0084-G

FIT0084-G

DFRobot

0.1" (2.54 MM) ARDUINO MALE PIN

11

MIKROE-573

MIKROE-573

MikroElektronika

BOARD EASYLED W/YELLOW DIODES

0

ISO-ADAPT

ISO-ADAPT

Keil (ARM)

ADAPTER ULINKPRO ISOLATION

5

DK-LM3S9B96-FS8

DK-LM3S9B96-FS8

Texas Instruments

BOARD ADD-ON FOR DK-LM3S9B96

1

240-037

240-037

Digilent, Inc.

ACCY IR RANGE SENSOR

0

TMC USB-2-RTMI

TMC USB-2-RTMI

TRINAMIC Motion Control GmbH

ADAPTER WITH USB-2-RTMI-CABLE

29

EHJ4C

EHJ4C

Advanced Linear Devices, Inc.

CABLE OUTPUT EH4200 TO EH300/1

0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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