Accessories

Image Part Number Description / PDF Quantity Rfq
800-00080

800-00080

Parallax, Inc.

CABLE ASSY PARALLAX MOTHERBOARD

0

PTC04-DB-MUPET

PTC04-DB-MUPET

Melexis

PTC04 DAUGHTERBOARD MUPET

0

KIT-15081

KIT-15081

SparkFun

QWIIC CABLE KIT

0

SPC5-CONNECT

SPC5-CONNECT

STMicroelectronics

USB INTERFACE PC TO DEV/MOD

0

8.06.14 J-LINK SUPPLY ADAPTER

8.06.14 J-LINK SUPPLY ADAPTER

Segger Microcontroller Systems

ADAPTER J-LINK SUPPLY

32

TC2030-MCP-10

TC2030-MCP-10

Tag-Connect

CABLE IN-CIRCUIT 10" W/LEGS

0

MIKROE-1142

MIKROE-1142

MikroElektronika

DISPLAY BOARD EASYTFT

0

OM13082UL

OM13082UL

NXP Semiconductors

SHIELD BOARD LPC GEN PURPOSE

3

2743

2743

Adafruit

BOARD BO SWD 2X5 1.27MM CBL

0

PTC-04-DB-HALL06

PTC-04-DB-HALL06

Melexis

PTC04 DAUGHTERBOARD HALL06

0

240-004

240-004

Digilent, Inc.

6-PIN HEADER PACK OF 5

0

CAB-14988

CAB-14988

SparkFun

QWIIC CABLE FEMALE JUMPER 4PIN

413

MIKROE-1302

MIKROE-1302

MikroElektronika

CBL THERM TYPE-K GLASS PCC-SMP

4

SOCKET-ADM106XLFZ

SOCKET-ADM106XLFZ

Analog Devices, Inc.

SOCKET FOR ADM106XLFZ

0

FP3-10PIN-ADAPTER-KIT

FP3-10PIN-ADAPTER-KIT

Roving Networks / Microchip Technology

HARDWARE ADAPTER KIT 10FPGA

0

ATJTAGICE3ACCKIT

ATJTAGICE3ACCKIT

Roving Networks / Microchip Technology

ACCESSORY KIT FOR JTAGICE3

0

OV10640CSP-S32V

OV10640CSP-S32V

NXP Semiconductors

OMNIVISION MIPI CAMERA FOR SBC-S

7

MA320013

MA320013

Roving Networks / Microchip Technology

MOD PIM BT AUDIO PIC32MX270256

0

MIKROE-224

MIKROE-224

MikroElektronika

BOARD ETHERNET CONNECTOR

1

DC2213A

DC2213A

Analog Devices, Inc.

DEDICATED RTD BOARD

5

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Interface CablesHigh-speed data transfer, hot-plugging supportUSB-UART converters, HDMI breakout cables
Power ModulesRegulated voltage output, battery managementLipo battery packs, DC-DC converters
Sensor ModulesDigital/analog signal acquisition, calibration-freeTemperature/humidity sensors, IMUs
Expansion BoardsPeripheral interface extension, protocol conversionMotor drivers, LoRaWAN shields
Debugging ToolsReal-time tracing, voltage measurementJTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

ParameterDescription
Interface CompatibilitySupports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling1.8V-24V input range, 5A max current
Signal Integrity12-bit ADC resolution (0.01% error), 1ns jitter
Environmental RatingOperating temp: -40 C to +85 C, IP54 dust/water resistance
EMC ComplianceFCC Part 15 Class B, CE EN55032

5. Application Fields

  • IoT Development: Smart home sensor nodes
  • Industrial Automation: PLC expansion modules
  • Consumer Electronics: Prototype gaming controllers
  • Education: Robotics training platforms
  • Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

ManufacturerRepresentative Products
ArduinoArduino MKR Shield, Nano I/O Breakout
Raspberry PiPico W Expansion Board, HAT+ Prototyping
STMicroelectronicsST-Link/V2 Debugger, X-NUCLEO Expansion
Texas InstrumentsLaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization

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