Accessories

Part Number	Description / PDF	Quantity
PUREPATH-CMBEVM Texas Instruments	KIT DEV PUREPATH MOTHERBOARD	0
8.06.16 J-LINK 6-PIN NEEDLE ADAPTER Segger Microcontroller Systems	J-LINK 6-PIN NEEDLE ADAPTER	103
LS400-118 LogiSwitch	ARDUINO WB W LS118 DEBOUNCE IC	94
OCB100CZ TT Electronics / Optek Technology	BOARD CALIBR WIRED OPTO ASSY	40
MOD-LCD3310 Olimex	OLIMEX EMBEDDDED MODULE	0
PLC-AC-COUPLER Roving Networks / Microchip Technology	PLC AC COUPLER	2
ATAVRCABLEKIT Roving Networks / Microchip Technology	KIT AVR TOOLS USB/CABLE	1
112990089 Seeed	EMMC MODULE 128G FOR ROCK PI 4	0
UPIO-M3U160-EK Silicon Labs	BOARD EXPANDER I/O CARD UDP	2
CY3083-03	MATRIX CARD FOR HI-LO PROG	5
CY3203-105 Cypress Semiconductor	PSOC EMU POD FT 44-TQFP 1=5PCS	1
MA330028 Roving Networks / Microchip Technology	MODULE PLUG-IN DSPIC33EP64MC504	0
AC162059 Roving Networks / Microchip Technology	HEADER INTRFC MPLAB ICD2 8/14PIN	0
PRT-14321 SparkFun	PHOTON HEADER - 12 PIN FEMALE	164
B-LCDAD-RPI1 STMicroelectronics	15-PIN SINGLE ROW FLEXIBLE PRINT	1
30014 Parallax, Inc.	CARTRIDGE INK HP51604 BLACK	0
ZM00056-KIT Power-One (Bel Power Solutions)	I2C/USB ADATPER FOR Z-ONE	0
ESELSBRUCKE TRINAMIC Motion Control GmbH	TMC CONNECTOR ADAPTER BOARD	44
ATAVR-MICTOR38 Roving Networks / Microchip Technology	MICTOR38 CONNECTOR NEXUS 767054-	2
MOD-RGB Olimex	MODULE RGB 3X5A RGB PWM CTRL	0

Accessories

1. Overview

Development board accessories are essential components that extend the functionality of microcontroller/processor development platforms. These accessories include interface cables, power modules, sensor modules, expansion boards, and debugging tools that enable rapid prototyping and system integration. As core enablers for embedded system development, IoT prototyping, and industrial automation, these accessories significantly reduce development time while improving hardware compatibility and measurement accuracy.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Interface Cables	High-speed data transfer, hot-plugging support	USB-UART converters, HDMI breakout cables
Power Modules	Regulated voltage output, battery management	Lipo battery packs, DC-DC converters
Sensor Modules	Digital/analog signal acquisition, calibration-free	Temperature/humidity sensors, IMUs
Expansion Boards	Peripheral interface extension, protocol conversion	Motor drivers, LoRaWAN shields
Debugging Tools	Real-time tracing, voltage measurement	JTAG probes, logic analyzers

3. Structure and Composition

Typical accessories feature: - Hardware Shell: Flame-retardant ABS or CNC-machined aluminum for mechanical protection - Interface Circuits: Level shifters and ESD protection components - Communication Modules: SPI/I2C/UART protocol converters - Power Conditioning: Voltage regulators and current limiting circuits - Mechanical Components: Mounting brackets and anti-vibration pads

4. Key Technical Specifications

Parameter	Description
Interface Compatibility	Supports USB 3.0, SPI up to 10MHz, I2C 400kHz
Power Handling	1.8V-24V input range, 5A max current
Signal Integrity	12-bit ADC resolution (0.01% error), 1ns jitter
Environmental Rating	Operating temp: -40 C to +85 C, IP54 dust/water resistance
EMC Compliance	FCC Part 15 Class B, CE EN55032

5. Application Fields

IoT Development: Smart home sensor nodes
Industrial Automation: PLC expansion modules
Consumer Electronics: Prototype gaming controllers
Education: Robotics training platforms
Medical Devices: Portable diagnostic equipment

6. Leading Manufacturers and Products

Manufacturer	Representative Products
Arduino	Arduino MKR Shield, Nano I/O Breakout
Raspberry Pi	Pico W Expansion Board, HAT+ Prototyping
STMicroelectronics	ST-Link/V2 Debugger, X-NUCLEO Expansion
Texas Instruments	LaunchPad SensorHub, BoosterPack MKII

7. Selection Guide

Key considerations: - Project requirements: Match sensor types and communication protocols - Compatibility: Verify voltage levels and physical dimensions - Expandability: Check available GPIO and bus interfaces - Cost-effectiveness: Balance performance vs. budget - Environmental factors: Temperature range and vibration resistance - Support ecosystem: Availability of libraries and community resources

8. Industry Trends

Emerging trends include: - Wireless integration (Bluetooth/WiFi 6 modules) - AI-enabled sensor fusion algorithms - Modular system-in-package (SiP) designs - Open-source hardware standardization - Energy-harvesting power solutions - Increased adoption of 2.54mm standardization