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Terminals - Quick Connects, Quick Disconnect Connectors

Image Part Number Description / PDF Quantity Rfq
7814

7814

Keystone Electronics Corp.

CONN QC TAB 0.250 SOLDER

404
1281

1281

Keystone Electronics Corp.

CONN QC TAB 0.250 SOLDER

19345
1264

1264

Keystone Electronics Corp.

CONN QC RCPT 16-22AWG 0.187

6837000
1289-ST

1289-ST

Keystone Electronics Corp.

CONN QC TAB 0.250 SOLDER

2147483647
7822

7822

Keystone Electronics Corp.

CONN QC TAB 0.250 SOLDER

7734500
1286-ST

1286-ST

Keystone Electronics Corp.

CONN QC TAB 0.205 SOLDER

2147483647
4928

4928

Keystone Electronics Corp.

QUICK FIT TERMINAL .240"

0
3579

3579

Keystone Electronics Corp.

.110" EDGE MNT CON

29556500
1234

1234

Keystone Electronics Corp.

CONN QC TAB 0.187

14091500
6102

6102

Keystone Electronics Corp.

SMT EDGE CONNECTOR, FEMALE

4727600
4919

4919

Keystone Electronics Corp.

CONN QC TAB 0.187 SOLDER

374910300
8299

8299

Keystone Electronics Corp.

CONN QC TAB 14-16AWG 0.250 CRIMP

1200
8292

8292

Keystone Electronics Corp.

CONN QC RCPT 18-22AWG 0.250

449611400
7804

7804

Keystone Electronics Corp.

CONN QC TAB 0.250 SOLDER

10752049
7803

7803

Keystone Electronics Corp.

CONN QC TAB 0.250 SOLDER

30010360
7833

7833

Keystone Electronics Corp.

CONN QC TAB 0.250 SOLDER

1230850
8298

8298

Keystone Electronics Corp.

CONN QC TAB 14-16AWG 0.187 CRIMP

1700
1213-ST

1213-ST

Keystone Electronics Corp.

CONN QC TAB 0.205 SOLDER

825411000
1266

1266

Keystone Electronics Corp.

CONN QC TAB 0.250 SOLDER

116118
8285

8285

Keystone Electronics Corp.

CONN QC TAB 10-12AWG 0.250 CRIMP

1200

Terminals - Quick Connects, Quick Disconnect Connectors

1. Overview

Quick connects/disconnects (QCDs) are electrical connectors designed for rapid, tool-free connection and disconnection of circuits. These components enable efficient maintenance, modular system design, and reliable signal/power transmission in complex systems. Their importance spans across industries requiring frequent interface changes while maintaining electrical integrity.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Single-contact QCDsSimple push-pull mechanism, 1-10A ratingConsumer electronics peripherals
Multicontact ArrayParallel signal/power paths, IP67 ratedIndustrial automation equipment
Hydraulic CouplingsFluid-tight sealing, 3000psi pressureConstruction machinery hydraulics
Blade TerminalsTab-width standardized (4.8-9.5mm), vibration-resistantAutomotive electrical systems
Push-to-ConnectSelf-locking collet mechanism, 0.5s engagementMedical device rapid deployment

3. Structural Composition

Typical QCD construction includes:

  • Dielectric housing (PA66, LCP, or PBT materials)
  • Contact elements (phosphor bronze, beryllium copper)
  • Retention mechanism (spring-loaded collets, detent balls)
  • Environmental seals (EPDM or silicone O-rings)
  • Strain relief components (integral cable clamps)

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance1-10 m Directly affects power loss
Insulation Resistance100M -10G Ensures circuit isolation
Operating Temperature-55 C to +150 CDetermines environmental suitability
Insertion Force5-50NImpacts user experience
Durability500-10,000 cyclesService life indicator

5. Application Fields

Primary industries include:

  • Automotive (EV charging interfaces, sensor harnesses)
  • Aerospace (avionics rack connections)
  • Industrial Automation (robotic arm tooling)
  • Medical (patient monitoring equipment)
  • Telecommunications (base station RF connections)

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Specification
TE ConnectivityMICRO SWITCH QTIP69K rated, 1000VAC
MolexPicoBlade 0.8mm0.3A contact rating
AmphenolQCD Series 262Hydraulic 3000psi capability
Weidm llerOMQ Quick ConnectVibration-proof design
DelphiMetri-Pack 150Automotive standard

7. Selection Guidelines

Key considerations:

  • Current/voltage requirements (derating factors)
  • Environmental protection needs (IP rating)
  • Engagement/disengagement frequency
  • Space constraints (3D footprint)
  • Material compatibility (corrosion resistance)
  • Certification requirements (UL, CE, MIL-STD)

8. Industry Trends

Current development trends include:

  • Nanocoating integration for corrosion resistance
  • Smart connectors with embedded sensors
  • Miniaturization (sub-mm contact spacing)
  • High-temperature superconducting materials
  • Automated mating systems for Industry 4.0

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