Terminals - Quick Connects, Quick Disconnect Connectors

Part Number	Description / PDF	Quantity
8289 Keystone Electronics Corp.	CONN QC TAB 14-16AWG 0.250 CRIMP	1600
4920 Keystone Electronics Corp.	CONN QC TAB 0.187 SOLDER	251521600
4928TR Keystone Electronics Corp.	QUICK FIT TERMINAL ON T&R .240"	12644
8286 Keystone Electronics Corp.	CONN QC TAB 18-22AWG 0.187 CRIMP	700
1287-ST Keystone Electronics Corp.	CONN QC TAB 0.250 SOLDER	0
1261 Keystone Electronics Corp.	CONN QC TAB 0.187	349500
8279 Keystone Electronics Corp.	CONN QC RCPT 14-16AWG 0.250	0
6102TR Keystone Electronics Corp.	SMT EDGE CONNECTOR, FEMALE ON T&	11118000
7802 Keystone Electronics Corp.	CONN QC TAB 0.250 SOLDER	13063702
4966 Keystone Electronics Corp.	CONN QC TAB 0.250 SOLDER	2147483647
3578 Keystone Electronics Corp.	CONN QC RCPT SOLDER	1144
8278 Keystone Electronics Corp.	CONN QC RCPT 14-16AWG 0.187	0
1228 Keystone Electronics Corp.	CONN QC TAB 0.187	24532100
2004 Keystone Electronics Corp.	CONN QC TAB 0.110	148722800
7816 Keystone Electronics Corp.	CONN QC TAB 0.250 SOLDER	0
1262 Keystone Electronics Corp.	CONN QC TAB 0.187	28515000
3579TR Keystone Electronics Corp.	.110 MALE SMT EDGE CONNECTOR ON	18396000
8296 Keystone Electronics Corp.	CONN QC TAB 18-22AWG 0.187 CRIMP	0
4912 Keystone Electronics Corp.	CONN QC TAB 0.250 SOLDER	1092
1233 Keystone Electronics Corp.	CONN QC TAB 0.110	326400

Terminals - Quick Connects, Quick Disconnect Connectors

1. Overview

Quick connects/disconnects (QCDs) are electrical connectors designed for rapid, tool-free connection and disconnection of circuits. These components enable efficient maintenance, modular system design, and reliable signal/power transmission in complex systems. Their importance spans across industries requiring frequent interface changes while maintaining electrical integrity.

2. Major Types & Functional Classification

Type	Functional Features	Application Examples
Single-contact QCDs	Simple push-pull mechanism, 1-10A rating	Consumer electronics peripherals
Multicontact Array	Parallel signal/power paths, IP67 rated	Industrial automation equipment
Hydraulic Couplings	Fluid-tight sealing, 3000psi pressure	Construction machinery hydraulics
Blade Terminals	Tab-width standardized (4.8-9.5mm), vibration-resistant	Automotive electrical systems
Push-to-Connect	Self-locking collet mechanism, 0.5s engagement	Medical device rapid deployment

3. Structural Composition

Typical QCD construction includes:

Dielectric housing (PA66, LCP, or PBT materials)
Contact elements (phosphor bronze, beryllium copper)
Retention mechanism (spring-loaded collets, detent balls)
Environmental seals (EPDM or silicone O-rings)
Strain relief components (integral cable clamps)

4. Key Technical Parameters

Parameter	Typical Range	Significance
Contact Resistance	1-10 m	Directly affects power loss
Insulation Resistance	100M -10G	Ensures circuit isolation
Operating Temperature	-55 C to +150 C	Determines environmental suitability
Insertion Force	5-50N	Impacts user experience
Durability	500-10,000 cycles	Service life indicator

5. Application Fields

Primary industries include:

Automotive (EV charging interfaces, sensor harnesses)
Aerospace (avionics rack connections)
Industrial Automation (robotic arm tooling)
Medical (patient monitoring equipment)
Telecommunications (base station RF connections)

6. Leading Manufacturers

Manufacturer	Representative Product	Key Specification
TE Connectivity	MICRO SWITCH QT	IP69K rated, 1000VAC
Molex	PicoBlade 0.8mm	0.3A contact rating
Amphenol	QCD Series 262	Hydraulic 3000psi capability
Weidm ller	OMQ Quick Connect	Vibration-proof design
Delphi	Metri-Pack 150	Automotive standard

7. Selection Guidelines

Key considerations:

Current/voltage requirements (derating factors)
Environmental protection needs (IP rating)
Engagement/disengagement frequency
Space constraints (3D footprint)
Material compatibility (corrosion resistance)
Certification requirements (UL, CE, MIL-STD)

8. Industry Trends

Current development trends include:

Nanocoating integration for corrosion resistance
Smart connectors with embedded sensors
Miniaturization (sub-mm contact spacing)
High-temperature superconducting materials
Automated mating systems for Industry 4.0