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Terminals - Quick Connects, Quick Disconnect Connectors

Image Part Number Description / PDF Quantity Rfq
3528

3528

Keystone Electronics Corp.

CONN QC RCPT 0.250 PRESS-FIT

81538
4918

4918

Keystone Electronics Corp.

CONN QC TAB 0.187 SOLDER

0
1212-ST

1212-ST

Keystone Electronics Corp.

CONN QC TAB 0.187 SOLDER

2147483647
8297

8297

Keystone Electronics Corp.

CONN QC TAB 18-22AWG 0.250 CRIMP

700
3525

3525

Keystone Electronics Corp.

CONN QC RCPT 0.205 PRESS-FIT

2258
8288

8288

Keystone Electronics Corp.

CONN QC TAB 14-16AWG 0.187 CRIMP

1200
4095

4095

Keystone Electronics Corp.

CONN QC TAB 0.187

998
1287-STR

1287-STR

Keystone Electronics Corp.

MALE .250" QUICK FIT TERMINAL ST

80606
1282

1282

Keystone Electronics Corp.

CONN QC TAB 0.110/0.250 SOLDER

2147483647
8290

8290

Keystone Electronics Corp.

CONN QC TAB 10-12AWG 0.250 CRIMP

500
1285-ST

1285-ST

Keystone Electronics Corp.

CONN QC TAB 0.187 SOLDER

2147483647
8275

8275

Keystone Electronics Corp.

CONN QC RCPT 14-16AWG 0.250

1200
6100TR

6100TR

Keystone Electronics Corp.

SMT EDGE CONNECTOR, MALE ON T&R

13718500
8277

8277

Keystone Electronics Corp.

CONN QC RCPT 18-22AWG 0.250

1900
1263

1263

Keystone Electronics Corp.

CONN QC TAB 0.187

19261300
8287

8287

Keystone Electronics Corp.

CONN QC TAB 18-22AWG 0.250 CRIMP

400
1292

1292

Keystone Electronics Corp.

CONN QC TAB 0.250 SOLDER

567413700
7813

7813

Keystone Electronics Corp.

CONN QC TAB 0.250 SOLDER

200107
1242

1242

Keystone Electronics Corp.

CONN QC TAB 0.250

25841600
4900

4900

Keystone Electronics Corp.

CONN QC TAB 0.187 SOLDER

458675300

Terminals - Quick Connects, Quick Disconnect Connectors

1. Overview

Quick connects/disconnects (QCDs) are electrical connectors designed for rapid, tool-free connection and disconnection of circuits. These components enable efficient maintenance, modular system design, and reliable signal/power transmission in complex systems. Their importance spans across industries requiring frequent interface changes while maintaining electrical integrity.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Single-contact QCDsSimple push-pull mechanism, 1-10A ratingConsumer electronics peripherals
Multicontact ArrayParallel signal/power paths, IP67 ratedIndustrial automation equipment
Hydraulic CouplingsFluid-tight sealing, 3000psi pressureConstruction machinery hydraulics
Blade TerminalsTab-width standardized (4.8-9.5mm), vibration-resistantAutomotive electrical systems
Push-to-ConnectSelf-locking collet mechanism, 0.5s engagementMedical device rapid deployment

3. Structural Composition

Typical QCD construction includes:

  • Dielectric housing (PA66, LCP, or PBT materials)
  • Contact elements (phosphor bronze, beryllium copper)
  • Retention mechanism (spring-loaded collets, detent balls)
  • Environmental seals (EPDM or silicone O-rings)
  • Strain relief components (integral cable clamps)

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance1-10 m Directly affects power loss
Insulation Resistance100M -10G Ensures circuit isolation
Operating Temperature-55 C to +150 CDetermines environmental suitability
Insertion Force5-50NImpacts user experience
Durability500-10,000 cyclesService life indicator

5. Application Fields

Primary industries include:

  • Automotive (EV charging interfaces, sensor harnesses)
  • Aerospace (avionics rack connections)
  • Industrial Automation (robotic arm tooling)
  • Medical (patient monitoring equipment)
  • Telecommunications (base station RF connections)

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Specification
TE ConnectivityMICRO SWITCH QTIP69K rated, 1000VAC
MolexPicoBlade 0.8mm0.3A contact rating
AmphenolQCD Series 262Hydraulic 3000psi capability
Weidm llerOMQ Quick ConnectVibration-proof design
DelphiMetri-Pack 150Automotive standard

7. Selection Guidelines

Key considerations:

  • Current/voltage requirements (derating factors)
  • Environmental protection needs (IP rating)
  • Engagement/disengagement frequency
  • Space constraints (3D footprint)
  • Material compatibility (corrosion resistance)
  • Certification requirements (UL, CE, MIL-STD)

8. Industry Trends

Current development trends include:

  • Nanocoating integration for corrosion resistance
  • Smart connectors with embedded sensors
  • Miniaturization (sub-mm contact spacing)
  • High-temperature superconducting materials
  • Automated mating systems for Industry 4.0

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