Terminals - Quick Connects, Quick Disconnect Connectors

Image Part Number Description / PDF Quantity Rfq
76-IMD16-250

76-IMD16-250

NTE Electronics, Inc.

PVC INS MALE DISCON 16-14

4624

7-520366-2

7-520366-2

TE Connectivity AMP Connectors

CONN QC RCPT 22-26AWG 0.110

23534

640909-1

640909-1

TE Connectivity AMP Connectors

CONN QC RCPT 18-22AWG 0.205

10186

DNG14-187FB-3K

DNG14-187FB-3K

Panduit Corporation

CONN QC RCPT 14-16AWG 0.187

6000

9-520272-2

9-520272-2

TE Connectivity AMP Connectors

CONN QC RCPT 18-22AWG 0.110

9521

0190080031

0190080031

Woodhead - Molex

CONN QC RCPT 14-16AWG 0.250

1987

0190070029

0190070029

Woodhead - Molex

CONN QC RCPT 14-16AWG 0.187

777

3-520404-2

3-520404-2

TE Connectivity AMP Connectors

CONN QC RCPT 14-16AWG 0.187

10394

0190180006

0190180006

Woodhead - Molex

CONN QC RCPT 18-22AWG 0.250

0

DNF18-187-M

DNF18-187-M

Panduit Corporation

CONN QC RCPT 18-22AWG 0.187

907

DNF14-187-C

DNF14-187-C

Panduit Corporation

CONN QC RCPT 14-16AWG 0.187

4827600

170340-3

170340-3

TE Connectivity AMP Connectors

CONN QC TAB 14-20AWG 0.250 CRIMP

4398

76-NFIFD16C

76-NFIFD16C

NTE Electronics, Inc.

NYLON FULLY INS FEM DISC 100 BAG

7

63314-2

63314-2

TE Connectivity AMP Connectors

CONN QC RCPT 14-18AWG 0.250

0

0190030052

0190030052

Woodhead - Molex

CONN QC RCPT 14-16AWG 0.187

769

1217133-1

1217133-1

TE Connectivity AMP Connectors

CONN QC TAB 0.187 SOLDER

541

DNF10-250FIB-E

DNF10-250FIB-E

Panduit Corporation

CONN QC RCPT 10-12AWG 0.250

145

521599-2

521599-2

TE Connectivity AMP Connectors

CONN QC RCPT 14-20AWG 0.187

0

521212-1

521212-1

TE Connectivity AMP Connectors

CONN QC RCPT 14-18AWG 0.187

0

94825

94825

3M

CONN QC TAB 14-16AWG 0.187 CRIMP

1176

Terminals - Quick Connects, Quick Disconnect Connectors

1. Overview

Quick connects/disconnects (QCDs) are electrical connectors designed for rapid, tool-free connection and disconnection of circuits. These components enable efficient maintenance, modular system design, and reliable signal/power transmission in complex systems. Their importance spans across industries requiring frequent interface changes while maintaining electrical integrity.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Single-contact QCDsSimple push-pull mechanism, 1-10A ratingConsumer electronics peripherals
Multicontact ArrayParallel signal/power paths, IP67 ratedIndustrial automation equipment
Hydraulic CouplingsFluid-tight sealing, 3000psi pressureConstruction machinery hydraulics
Blade TerminalsTab-width standardized (4.8-9.5mm), vibration-resistantAutomotive electrical systems
Push-to-ConnectSelf-locking collet mechanism, 0.5s engagementMedical device rapid deployment

3. Structural Composition

Typical QCD construction includes:

  • Dielectric housing (PA66, LCP, or PBT materials)
  • Contact elements (phosphor bronze, beryllium copper)
  • Retention mechanism (spring-loaded collets, detent balls)
  • Environmental seals (EPDM or silicone O-rings)
  • Strain relief components (integral cable clamps)

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance1-10 m Directly affects power loss
Insulation Resistance100M -10G Ensures circuit isolation
Operating Temperature-55 C to +150 CDetermines environmental suitability
Insertion Force5-50NImpacts user experience
Durability500-10,000 cyclesService life indicator

5. Application Fields

Primary industries include:

  • Automotive (EV charging interfaces, sensor harnesses)
  • Aerospace (avionics rack connections)
  • Industrial Automation (robotic arm tooling)
  • Medical (patient monitoring equipment)
  • Telecommunications (base station RF connections)

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Specification
TE ConnectivityMICRO SWITCH QTIP69K rated, 1000VAC
MolexPicoBlade 0.8mm0.3A contact rating
AmphenolQCD Series 262Hydraulic 3000psi capability
Weidm llerOMQ Quick ConnectVibration-proof design
DelphiMetri-Pack 150Automotive standard

7. Selection Guidelines

Key considerations:

  • Current/voltage requirements (derating factors)
  • Environmental protection needs (IP rating)
  • Engagement/disengagement frequency
  • Space constraints (3D footprint)
  • Material compatibility (corrosion resistance)
  • Certification requirements (UL, CE, MIL-STD)

8. Industry Trends

Current development trends include:

  • Nanocoating integration for corrosion resistance
  • Smart connectors with embedded sensors
  • Miniaturization (sub-mm contact spacing)
  • High-temperature superconducting materials
  • Automated mating systems for Industry 4.0

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