Terminals - Quick Connects, Quick Disconnect Connectors

Image Part Number Description / PDF Quantity Rfq
41829

41829

TE Connectivity AMP Connectors

FASTON 250 (6.3 MM) REC 14-12 AW

15892

140805-2

140805-2

TE Connectivity AMP Connectors

TERMINAL REC FASTON PIDG 5

6367

2-520334-2

2-520334-2

TE Connectivity AMP Connectors

CONN QC RCPT 18-22AWG 0.187

2477

DNG14-250FB-L

DNG14-250FB-L

Panduit Corporation

CONN QC RCPT 14-16AWG 0.250

173

5-160303-1

5-160303-1

TE Connectivity AMP Connectors

CONN QC RCPT 20-22AWG 0.110

0

341299-2

341299-2

TE Connectivity AMP Connectors

POSILOK RECEPT MK II .250

44800

0190190012

0190190012

Woodhead - Molex

CONN QC RCPT 18-22AWG 0.250

4855

B-106-3631

B-106-3631

TE Connectivity Aerospace Defense and Marine

CONN QC RCPT 18-22AWG 0.250

190

3240051

3240051

Phoenix Contact

CONN QC RCPT 16-20AWG 0.187

0

76-NIMD16-187C

76-NIMD16-187C

NTE Electronics, Inc.

NYLON INS MALE DISCONNECT 100 BA

2

8285

8285

Keystone Electronics Corp.

CONN QC TAB 10-12AWG 0.250 CRIMP

1200

D10-250C-D

D10-250C-D

Panduit Corporation

CONN QC RCPT 10-12AWG 0.250

795

76-NIPD16C

76-NIPD16C

NTE Electronics, Inc.

NYLON INS PIGGYBACK DISC 100 BAG

4

3528

3528

Keystone Electronics Corp.

CONN QC RCPT 0.250 PRESS-FIT

81538

ED18-250-Q

ED18-250-Q

Panduit Corporation

STRONGHOLD FEMALE DISCONNECT, NO

4650

1742088-2

1742088-2

TE Connectivity AMP Connectors

CONN QC RCPT 14-18AWG 0.187

17670

880645-6

880645-6

TE Connectivity AMP Connectors

CONN QC RCPT 13-17AWG 0.250

2672

63119-1

63119-1

TE Connectivity AMP Connectors

CONN QC RCPT 18-22AWG 0.250

11936

1217002-1

1217002-1

TE Connectivity AMP Connectors

CONN QC TAB 0.250 WELD

0

63391-2

63391-2

TE Connectivity AMP Connectors

CONN QC RCPT 18-22AWG 0.093

32702

Terminals - Quick Connects, Quick Disconnect Connectors

1. Overview

Quick connects/disconnects (QCDs) are electrical connectors designed for rapid, tool-free connection and disconnection of circuits. These components enable efficient maintenance, modular system design, and reliable signal/power transmission in complex systems. Their importance spans across industries requiring frequent interface changes while maintaining electrical integrity.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Single-contact QCDsSimple push-pull mechanism, 1-10A ratingConsumer electronics peripherals
Multicontact ArrayParallel signal/power paths, IP67 ratedIndustrial automation equipment
Hydraulic CouplingsFluid-tight sealing, 3000psi pressureConstruction machinery hydraulics
Blade TerminalsTab-width standardized (4.8-9.5mm), vibration-resistantAutomotive electrical systems
Push-to-ConnectSelf-locking collet mechanism, 0.5s engagementMedical device rapid deployment

3. Structural Composition

Typical QCD construction includes:

  • Dielectric housing (PA66, LCP, or PBT materials)
  • Contact elements (phosphor bronze, beryllium copper)
  • Retention mechanism (spring-loaded collets, detent balls)
  • Environmental seals (EPDM or silicone O-rings)
  • Strain relief components (integral cable clamps)

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance1-10 m Directly affects power loss
Insulation Resistance100M -10G Ensures circuit isolation
Operating Temperature-55 C to +150 CDetermines environmental suitability
Insertion Force5-50NImpacts user experience
Durability500-10,000 cyclesService life indicator

5. Application Fields

Primary industries include:

  • Automotive (EV charging interfaces, sensor harnesses)
  • Aerospace (avionics rack connections)
  • Industrial Automation (robotic arm tooling)
  • Medical (patient monitoring equipment)
  • Telecommunications (base station RF connections)

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Specification
TE ConnectivityMICRO SWITCH QTIP69K rated, 1000VAC
MolexPicoBlade 0.8mm0.3A contact rating
AmphenolQCD Series 262Hydraulic 3000psi capability
Weidm llerOMQ Quick ConnectVibration-proof design
DelphiMetri-Pack 150Automotive standard

7. Selection Guidelines

Key considerations:

  • Current/voltage requirements (derating factors)
  • Environmental protection needs (IP rating)
  • Engagement/disengagement frequency
  • Space constraints (3D footprint)
  • Material compatibility (corrosion resistance)
  • Certification requirements (UL, CE, MIL-STD)

8. Industry Trends

Current development trends include:

  • Nanocoating integration for corrosion resistance
  • Smart connectors with embedded sensors
  • Miniaturization (sub-mm contact spacing)
  • High-temperature superconducting materials
  • Automated mating systems for Industry 4.0

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