Terminals - Quick Connects, Quick Disconnect Connectors

Image Part Number Description / PDF Quantity Rfq
1217124-1

1217124-1

TE Connectivity AMP Connectors

CONN QC TAB 0.187 SOLDER

0

0197124001

0197124001

Woodhead - Molex

CONN QC TAB 0.110 SOLDER

9390

62553-3

62553-3

TE Connectivity AMP Connectors

CONN QC TAB 18-22AWG 0.250 CRIMP

0

521384-4

521384-4

TE Connectivity AMP Connectors

CONN HDR FASTON 0.250 4POS R/A

2111

60249-1

60249-1

TE Connectivity AMP Connectors

CONN QC RCPT 12-16AWG 0.250

22140

928931-2

928931-2

TE Connectivity AMP Connectors

CONN QC TAB 17-20AWG 0.110 CRIMP

0

61549-1

61549-1

TE Connectivity AMP Connectors

CONN QC RCPT 16-22AWG 0.110

0

521747-1

521747-1

TE Connectivity AMP Connectors

250 ULTRA-POD TAB 18-14 BR

4473

140717-2

140717-2

TE Connectivity AMP Connectors

CONN QC RCPT 18-22AWG 0.110

18019

HT-73F-250-32

HT-73F-250-32

3M

CONN QC RCPT 10-12AWG 0.250

24

0192730008

0192730008

Woodhead - Molex

CONN QC RCPT 14-16AWG 0.250

7780

76-FT22

76-FT22

NTE Electronics, Inc.

NON INS FLAG TERM 22-18WG

2261

280095-1

280095-1

TE Connectivity AMP Connectors

CONN QC RCPT 18-22AWG 0.250

0

0190030024

0190030024

Woodhead - Molex

CONN QC RCPT 18-22AWG 0.110

20087

MTI14-250Q

MTI14-250Q

3M

MALE DISCON NYLON INS HIGHLAND

560

0192750002

0192750002

Woodhead - Molex

CONN QC RCPT 18-22AWG 0.250

2809

94804

94804

3M

CONN QC RCPT 18-22AWG 0.250

890

2-521104-2

2-521104-2

TE Connectivity AMP Connectors

CONN QC TAB 18-22AWG 0.187 CRIMP

8622

0190190048

0190190048

Woodhead - Molex

CONN QC RCPT 12-14AWG 0.187

11327

42098-1

42098-1

TE Connectivity AMP Connectors

CONN QC TAB 14-18AWG 0.250 CRIMP

6719

Terminals - Quick Connects, Quick Disconnect Connectors

1. Overview

Quick connects/disconnects (QCDs) are electrical connectors designed for rapid, tool-free connection and disconnection of circuits. These components enable efficient maintenance, modular system design, and reliable signal/power transmission in complex systems. Their importance spans across industries requiring frequent interface changes while maintaining electrical integrity.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Single-contact QCDsSimple push-pull mechanism, 1-10A ratingConsumer electronics peripherals
Multicontact ArrayParallel signal/power paths, IP67 ratedIndustrial automation equipment
Hydraulic CouplingsFluid-tight sealing, 3000psi pressureConstruction machinery hydraulics
Blade TerminalsTab-width standardized (4.8-9.5mm), vibration-resistantAutomotive electrical systems
Push-to-ConnectSelf-locking collet mechanism, 0.5s engagementMedical device rapid deployment

3. Structural Composition

Typical QCD construction includes:

  • Dielectric housing (PA66, LCP, or PBT materials)
  • Contact elements (phosphor bronze, beryllium copper)
  • Retention mechanism (spring-loaded collets, detent balls)
  • Environmental seals (EPDM or silicone O-rings)
  • Strain relief components (integral cable clamps)

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance1-10 m Directly affects power loss
Insulation Resistance100M -10G Ensures circuit isolation
Operating Temperature-55 C to +150 CDetermines environmental suitability
Insertion Force5-50NImpacts user experience
Durability500-10,000 cyclesService life indicator

5. Application Fields

Primary industries include:

  • Automotive (EV charging interfaces, sensor harnesses)
  • Aerospace (avionics rack connections)
  • Industrial Automation (robotic arm tooling)
  • Medical (patient monitoring equipment)
  • Telecommunications (base station RF connections)

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Specification
TE ConnectivityMICRO SWITCH QTIP69K rated, 1000VAC
MolexPicoBlade 0.8mm0.3A contact rating
AmphenolQCD Series 262Hydraulic 3000psi capability
Weidm llerOMQ Quick ConnectVibration-proof design
DelphiMetri-Pack 150Automotive standard

7. Selection Guidelines

Key considerations:

  • Current/voltage requirements (derating factors)
  • Environmental protection needs (IP rating)
  • Engagement/disengagement frequency
  • Space constraints (3D footprint)
  • Material compatibility (corrosion resistance)
  • Certification requirements (UL, CE, MIL-STD)

8. Industry Trends

Current development trends include:

  • Nanocoating integration for corrosion resistance
  • Smart connectors with embedded sensors
  • Miniaturization (sub-mm contact spacing)
  • High-temperature superconducting materials
  • Automated mating systems for Industry 4.0

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