Terminals - Quick Connects, Quick Disconnect Connectors

Image Part Number Description / PDF Quantity Rfq
63982-1

63982-1

TE Connectivity AMP Connectors

CONN QC TAB 0.187 SOLDER

14964

DNF14-250-M

DNF14-250-M

Panduit Corporation

CONN QC RCPT 14-16AWG 0.250

350017000

0190020037

0190020037

Woodhead - Molex

CONN QC RCPT 14-16AWG 0.110

0

638363122002

638363122002

Würth Elektronik Midcom

WR-FAST_THT MALE RIGHT ANGLED HE

100

FDI18-187Q

FDI18-187Q

3M

FM DISCONNECT FULLY NYLON INS

3159

165566-2

165566-2

TE Connectivity AMP Connectors

110 PIDG FASTON REC

7702

70F-110-32-PB

70F-110-32-PB

3M

CONN QC RCPT 22-26AWG 0.110

464

DV14-206B-M

DV14-206B-M

Panduit Corporation

CONN QC RCPT 14-16AWG 0.187

843

ED14-250MB-Q

ED14-250MB-Q

Panduit Corporation

STRONGHOLD MALE DISCONNECT, NON-

4990

2-520084-2

2-520084-2

TE Connectivity AMP Connectors

CONN QC RCPT 18-22AWG 0.110

47580

76-NIPD22C

76-NIPD22C

NTE Electronics, Inc.

NYLON INS PIGGYBACK DISC 100 BAG

5

0190080029

0190080029

Woodhead - Molex

CONN QC RCPT 14-16AWG 0.187

3603

1969109-1

1969109-1

TE Connectivity AMP Connectors

250 ULTRA-POD FLAG 18-14 BR

6645

0192740005

0192740005

Woodhead - Molex

CONN QC RCPT 14-16AWG 0.250

6107

0190030030

0190030030

Woodhead - Molex

CONN QC RCPT 18-22AWG 0.110

2603

1217073-1

1217073-1

TE Connectivity AMP Connectors

CONN QC TAB 1500-5000CMA 0.125

8577

94827

94827

3M

CONN QC TAB 14-16AWG 0.250 CRIMP

1022

3240156

3240156

Phoenix Contact

CONN QC RCPT 16-20AWG 0.250

0

184235-1

184235-1

TE Connectivity AMP Connectors

CONN QC RCPT 14-16AWG 0.187

962

170467-1

170467-1

TE Connectivity AMP Connectors

CONN QC RCPT 14-18AWG 0.187

12260

Terminals - Quick Connects, Quick Disconnect Connectors

1. Overview

Quick connects/disconnects (QCDs) are electrical connectors designed for rapid, tool-free connection and disconnection of circuits. These components enable efficient maintenance, modular system design, and reliable signal/power transmission in complex systems. Their importance spans across industries requiring frequent interface changes while maintaining electrical integrity.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Single-contact QCDsSimple push-pull mechanism, 1-10A ratingConsumer electronics peripherals
Multicontact ArrayParallel signal/power paths, IP67 ratedIndustrial automation equipment
Hydraulic CouplingsFluid-tight sealing, 3000psi pressureConstruction machinery hydraulics
Blade TerminalsTab-width standardized (4.8-9.5mm), vibration-resistantAutomotive electrical systems
Push-to-ConnectSelf-locking collet mechanism, 0.5s engagementMedical device rapid deployment

3. Structural Composition

Typical QCD construction includes:

  • Dielectric housing (PA66, LCP, or PBT materials)
  • Contact elements (phosphor bronze, beryllium copper)
  • Retention mechanism (spring-loaded collets, detent balls)
  • Environmental seals (EPDM or silicone O-rings)
  • Strain relief components (integral cable clamps)

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance1-10 m Directly affects power loss
Insulation Resistance100M -10G Ensures circuit isolation
Operating Temperature-55 C to +150 CDetermines environmental suitability
Insertion Force5-50NImpacts user experience
Durability500-10,000 cyclesService life indicator

5. Application Fields

Primary industries include:

  • Automotive (EV charging interfaces, sensor harnesses)
  • Aerospace (avionics rack connections)
  • Industrial Automation (robotic arm tooling)
  • Medical (patient monitoring equipment)
  • Telecommunications (base station RF connections)

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Specification
TE ConnectivityMICRO SWITCH QTIP69K rated, 1000VAC
MolexPicoBlade 0.8mm0.3A contact rating
AmphenolQCD Series 262Hydraulic 3000psi capability
Weidm llerOMQ Quick ConnectVibration-proof design
DelphiMetri-Pack 150Automotive standard

7. Selection Guidelines

Key considerations:

  • Current/voltage requirements (derating factors)
  • Environmental protection needs (IP rating)
  • Engagement/disengagement frequency
  • Space constraints (3D footprint)
  • Material compatibility (corrosion resistance)
  • Certification requirements (UL, CE, MIL-STD)

8. Industry Trends

Current development trends include:

  • Nanocoating integration for corrosion resistance
  • Smart connectors with embedded sensors
  • Miniaturization (sub-mm contact spacing)
  • High-temperature superconducting materials
  • Automated mating systems for Industry 4.0

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