Terminals - Quick Connects, Quick Disconnect Connectors

Image Part Number Description / PDF Quantity Rfq
DNFR14-206FIB-M

DNFR14-206FIB-M

Panduit Corporation

CONN QC RCPT 14-16AWG 0.187

1644

D14-250MB-M

D14-250MB-M

Panduit Corporation

CONN QC TAB 14-16AWG 0.250 CRIMP

1218914000

71F-187-20

71F-187-20

3M

CONN QC RCPT 18-22AWG 0.187

1360

42452-2

42452-2

TE Connectivity AMP Connectors

CONN QC RCPT 16-20AWG 0.187

37337

0190160082

0190160082

Woodhead - Molex

CONN QC RCPT 12-14AWG 0.187

16097500

926820-8

926820-8

TE Connectivity AMP Connectors

POS-LOCK FAH-STECKH

4000

5-160506-3

5-160506-3

TE Connectivity AMP Connectors

CONN QC RCPT 15.5-20AWG 0.250

0

170048-4

170048-4

TE Connectivity AMP Connectors

CONN QC RCPT 20-24AWG 0.110

7311

61070-1

61070-1

TE Connectivity AMP Connectors

CONN QC RCPT 18-22AWG 0.110

1644

2-520128-2

2-520128-2

TE Connectivity AMP Connectors

CONN QC RCPT 18-22AWG 0.250

0

62026-1

62026-1

TE Connectivity AMP Connectors

CONN QC RCPT/TAB 16-20AWG 0.187

710

150699-2

150699-2

TE Connectivity AMP Connectors

CONN QC RCPT 16-20AWG 0.187

319672

0190060011

0190060011

Woodhead - Molex

CONN QC RCPT 14-16AWG 0.250

16513

71F-250-32

71F-250-32

3M

CONN QC RCPT 18-22AWG 0.250

2094

D18-187-M

D18-187-M

Panduit Corporation

CONN QC RCPT 18-22AWG 0.187

10416000

170454-2

170454-2

TE Connectivity AMP Connectors

CONN QC RCPT 14-18AWG 0.250

6486

63769-1

63769-1

TE Connectivity AMP Connectors

CONN QC RCPT 16-18AWG 0.187

35645

DNF18-111FIB-3K

DNF18-111FIB-3K

Panduit Corporation

CONN QC RCPT 18-22AWG 0.110

0

521284-2

521284-2

TE Connectivity AMP Connectors

CONN QC RCPT 16-20AWG 0.187

0

0350729702

0350729702

Woodhead - Molex

CONN QC RCPT 18-22AWG 0.250

2709

Terminals - Quick Connects, Quick Disconnect Connectors

1. Overview

Quick connects/disconnects (QCDs) are electrical connectors designed for rapid, tool-free connection and disconnection of circuits. These components enable efficient maintenance, modular system design, and reliable signal/power transmission in complex systems. Their importance spans across industries requiring frequent interface changes while maintaining electrical integrity.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Single-contact QCDsSimple push-pull mechanism, 1-10A ratingConsumer electronics peripherals
Multicontact ArrayParallel signal/power paths, IP67 ratedIndustrial automation equipment
Hydraulic CouplingsFluid-tight sealing, 3000psi pressureConstruction machinery hydraulics
Blade TerminalsTab-width standardized (4.8-9.5mm), vibration-resistantAutomotive electrical systems
Push-to-ConnectSelf-locking collet mechanism, 0.5s engagementMedical device rapid deployment

3. Structural Composition

Typical QCD construction includes:

  • Dielectric housing (PA66, LCP, or PBT materials)
  • Contact elements (phosphor bronze, beryllium copper)
  • Retention mechanism (spring-loaded collets, detent balls)
  • Environmental seals (EPDM or silicone O-rings)
  • Strain relief components (integral cable clamps)

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance1-10 m Directly affects power loss
Insulation Resistance100M -10G Ensures circuit isolation
Operating Temperature-55 C to +150 CDetermines environmental suitability
Insertion Force5-50NImpacts user experience
Durability500-10,000 cyclesService life indicator

5. Application Fields

Primary industries include:

  • Automotive (EV charging interfaces, sensor harnesses)
  • Aerospace (avionics rack connections)
  • Industrial Automation (robotic arm tooling)
  • Medical (patient monitoring equipment)
  • Telecommunications (base station RF connections)

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Specification
TE ConnectivityMICRO SWITCH QTIP69K rated, 1000VAC
MolexPicoBlade 0.8mm0.3A contact rating
AmphenolQCD Series 262Hydraulic 3000psi capability
Weidm llerOMQ Quick ConnectVibration-proof design
DelphiMetri-Pack 150Automotive standard

7. Selection Guidelines

Key considerations:

  • Current/voltage requirements (derating factors)
  • Environmental protection needs (IP rating)
  • Engagement/disengagement frequency
  • Space constraints (3D footprint)
  • Material compatibility (corrosion resistance)
  • Certification requirements (UL, CE, MIL-STD)

8. Industry Trends

Current development trends include:

  • Nanocoating integration for corrosion resistance
  • Smart connectors with embedded sensors
  • Miniaturization (sub-mm contact spacing)
  • High-temperature superconducting materials
  • Automated mating systems for Industry 4.0

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