Terminals - Quick Connects, Quick Disconnect Connectors

Part Number	Description / PDF	Quantity
928794-2 TE Connectivity AMP Connectors	CONN QC TAB 13-17AWG 0.110 CRIMP	5184
170108-4 TE Connectivity AMP Connectors	CONN QC RCPT 14-18AWG 0.250	31977
63306-1 TE Connectivity AMP Connectors	CONN QC RCPT 14-18AWG 0.250	0
0197084011 Woodhead - Molex	CONN QC TAB 0.187 SOLDER	5077
42563-8 TE Connectivity AMP Connectors	CONN QC RCPT 10-12AWG 0.250	2913
63104-1 TE Connectivity AMP Connectors	CONN QC TAB 15-20AWG 0.250 CRIMP	9000
63560-1 TE Connectivity AMP Connectors	CONN QC RCPT 16-20AWG 0.110	0
76-MD22-187C NTE Electronics, Inc.	NON INS MALE DISCONNECT 100 BAG	8
7471286 Würth Elektronik Midcom	CIRCUIT-BOARD BLADE TERMINAL 5.2	365
76-IPD22L NTE Electronics, Inc.	PVC INS PIGGYBACK DISCONN 50 BAG	6
638263222007 Würth Elektronik Midcom	WR-FAST_THT MALE VERTICAL HEADER	100
5-160447-2 TE Connectivity AMP Connectors	CONN QC RCPT 13-17AWG 0.250	2907
76-IPD22C NTE Electronics, Inc.	PVC INS PIGGYBACK DISCONN 100 BA	0
EDV10-250M-Q Panduit Corporation	STRONGHOLD MALE DISCONNECT, VINY	3830
150500-2 TE Connectivity AMP Connectors	CONN QC RCPT 20-24AWG 0.110	3829
8-640917-1 TE Connectivity AMP Connectors	CONN QC RCPT 18-22AWG 0.187	2145
0190190004 Woodhead - Molex	CONN QC RCPT 18-22AWG 0.110	2148
0196001300 Woodhead - Molex	CONN QC RCPT 16-22AWG 0.250	0
175057-2 TE Connectivity AMP Connectors	250 POSITIVE LOCK EX FLAG REC	20810
167892-2 TE Connectivity AMP Connectors	CONN QC TAB 0.250 PRESS-FIT	1460

Terminals - Quick Connects, Quick Disconnect Connectors

1. Overview

Quick connects/disconnects (QCDs) are electrical connectors designed for rapid, tool-free connection and disconnection of circuits. These components enable efficient maintenance, modular system design, and reliable signal/power transmission in complex systems. Their importance spans across industries requiring frequent interface changes while maintaining electrical integrity.

2. Major Types & Functional Classification

Type	Functional Features	Application Examples
Single-contact QCDs	Simple push-pull mechanism, 1-10A rating	Consumer electronics peripherals
Multicontact Array	Parallel signal/power paths, IP67 rated	Industrial automation equipment
Hydraulic Couplings	Fluid-tight sealing, 3000psi pressure	Construction machinery hydraulics
Blade Terminals	Tab-width standardized (4.8-9.5mm), vibration-resistant	Automotive electrical systems
Push-to-Connect	Self-locking collet mechanism, 0.5s engagement	Medical device rapid deployment

3. Structural Composition

Typical QCD construction includes:

Dielectric housing (PA66, LCP, or PBT materials)
Contact elements (phosphor bronze, beryllium copper)
Retention mechanism (spring-loaded collets, detent balls)
Environmental seals (EPDM or silicone O-rings)
Strain relief components (integral cable clamps)

4. Key Technical Parameters

Parameter	Typical Range	Significance
Contact Resistance	1-10 m	Directly affects power loss
Insulation Resistance	100M -10G	Ensures circuit isolation
Operating Temperature	-55 C to +150 C	Determines environmental suitability
Insertion Force	5-50N	Impacts user experience
Durability	500-10,000 cycles	Service life indicator

5. Application Fields

Primary industries include:

Automotive (EV charging interfaces, sensor harnesses)
Aerospace (avionics rack connections)
Industrial Automation (robotic arm tooling)
Medical (patient monitoring equipment)
Telecommunications (base station RF connections)

6. Leading Manufacturers

Manufacturer	Representative Product	Key Specification
TE Connectivity	MICRO SWITCH QT	IP69K rated, 1000VAC
Molex	PicoBlade 0.8mm	0.3A contact rating
Amphenol	QCD Series 262	Hydraulic 3000psi capability
Weidm ller	OMQ Quick Connect	Vibration-proof design
Delphi	Metri-Pack 150	Automotive standard

7. Selection Guidelines

Key considerations:

Current/voltage requirements (derating factors)
Environmental protection needs (IP rating)
Engagement/disengagement frequency
Space constraints (3D footprint)
Material compatibility (corrosion resistance)
Certification requirements (UL, CE, MIL-STD)

8. Industry Trends

Current development trends include:

Nanocoating integration for corrosion resistance
Smart connectors with embedded sensors
Miniaturization (sub-mm contact spacing)
High-temperature superconducting materials
Automated mating systems for Industry 4.0