Terminals - Quick Connects, Quick Disconnect Connectors

Image Part Number Description / PDF Quantity Rfq
MTI14-187Q

MTI14-187Q

3M

MALE DISCON NYLON HIGHLAND 1=1PC

634

170466-1

170466-1

TE Connectivity AMP Connectors

CONN QC RCPT 14-18AWG 0.187

20700

94833

94833

3M

CONN QC RCPT 10-12AWG 0.250

1570

DNF10-250FI-L

DNF10-250FI-L

Panduit Corporation

CONN QC RCPT 10-12AWG 0.250

4818

MNU14-250DMIX-BOTTLE

MNU14-250DMIX-BOTTLE

3M

CONN QC TAB 14-16AWG 0.250 CRIMP

142

DV14-250B-3K

DV14-250B-3K

Panduit Corporation

CONN QC RCPT 14-16AWG 0.250

61587000

42475-2

42475-2

TE Connectivity AMP Connectors

.250 FAST TAB F O 22-18 TPBR

5325

170042-1

170042-1

TE Connectivity AMP Connectors

CONN QC RCPT 16-20AWG 0.110

13194

DNF18-250FI-M

DNF18-250FI-M

Panduit Corporation

CONN QC RCPT 18-22AWG 0.250

2650

521225-1

521225-1

TE Connectivity AMP Connectors

CONN QC RCPT 16-20AWG 0.187

0

900318-1

900318-1

TE Connectivity AMP Connectors

CONN QC RCPT 18-20AWG 0.312

7350

175032-1

175032-1

TE Connectivity AMP Connectors

CONN QC RCPT 20-26AWG 0.187

0

1281

1281

Keystone Electronics Corp.

CONN QC TAB 0.250 SOLDER

19345

DNFR14-206FIB-L

DNFR14-206FIB-L

Panduit Corporation

CONN QC RCPT 14-16AWG 0.187

200

76-IMD16-187C

76-IMD16-187C

NTE Electronics, Inc.

PVC INS MALE DISCON 16-14 100 BA

2

42282-1

42282-1

TE Connectivity AMP Connectors

CONN QC RCPT 14-18AWG 0.250

9836

42565-2

42565-2

TE Connectivity AMP Connectors

CONN QC TAB 16-18AWG 0.250 CRIMP

6203

DNF18-111-C

DNF18-111-C

Panduit Corporation

CONN QC RCPT 18-22AWG 0.110

1604660

140825-2

140825-2

TE Connectivity AMP Connectors

CONN QC RCPT 17-22AWG 0.110

39064

1264

1264

Keystone Electronics Corp.

CONN QC RCPT 16-22AWG 0.187

6837000

Terminals - Quick Connects, Quick Disconnect Connectors

1. Overview

Quick connects/disconnects (QCDs) are electrical connectors designed for rapid, tool-free connection and disconnection of circuits. These components enable efficient maintenance, modular system design, and reliable signal/power transmission in complex systems. Their importance spans across industries requiring frequent interface changes while maintaining electrical integrity.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Single-contact QCDsSimple push-pull mechanism, 1-10A ratingConsumer electronics peripherals
Multicontact ArrayParallel signal/power paths, IP67 ratedIndustrial automation equipment
Hydraulic CouplingsFluid-tight sealing, 3000psi pressureConstruction machinery hydraulics
Blade TerminalsTab-width standardized (4.8-9.5mm), vibration-resistantAutomotive electrical systems
Push-to-ConnectSelf-locking collet mechanism, 0.5s engagementMedical device rapid deployment

3. Structural Composition

Typical QCD construction includes:

  • Dielectric housing (PA66, LCP, or PBT materials)
  • Contact elements (phosphor bronze, beryllium copper)
  • Retention mechanism (spring-loaded collets, detent balls)
  • Environmental seals (EPDM or silicone O-rings)
  • Strain relief components (integral cable clamps)

4. Key Technical Parameters

ParameterTypical RangeSignificance
Contact Resistance1-10 m Directly affects power loss
Insulation Resistance100M -10G Ensures circuit isolation
Operating Temperature-55 C to +150 CDetermines environmental suitability
Insertion Force5-50NImpacts user experience
Durability500-10,000 cyclesService life indicator

5. Application Fields

Primary industries include:

  • Automotive (EV charging interfaces, sensor harnesses)
  • Aerospace (avionics rack connections)
  • Industrial Automation (robotic arm tooling)
  • Medical (patient monitoring equipment)
  • Telecommunications (base station RF connections)

6. Leading Manufacturers

ManufacturerRepresentative ProductKey Specification
TE ConnectivityMICRO SWITCH QTIP69K rated, 1000VAC
MolexPicoBlade 0.8mm0.3A contact rating
AmphenolQCD Series 262Hydraulic 3000psi capability
Weidm llerOMQ Quick ConnectVibration-proof design
DelphiMetri-Pack 150Automotive standard

7. Selection Guidelines

Key considerations:

  • Current/voltage requirements (derating factors)
  • Environmental protection needs (IP rating)
  • Engagement/disengagement frequency
  • Space constraints (3D footprint)
  • Material compatibility (corrosion resistance)
  • Certification requirements (UL, CE, MIL-STD)

8. Industry Trends

Current development trends include:

  • Nanocoating integration for corrosion resistance
  • Smart connectors with embedded sensors
  • Miniaturization (sub-mm contact spacing)
  • High-temperature superconducting materials
  • Automated mating systems for Industry 4.0

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