Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
0009484109 Woodhead - Molex	CONN RCPT 10POS 0.156 TIN PCB	1786
5025840870 Woodhead - Molex	CONN RCPT 8POS 0.059 TIN SMD	2194
5031590600 Woodhead - Molex	CONN RCPT 6POS 0.059 TIN PCB	12363
5025850570 Woodhead - Molex	CONN RCPT 5POS 0.059 TIN SMD R/A	3290
5054050370 Woodhead - Molex	CONN RCPT 3POS 0.059 GOLD SMD	12846
0901512108 Woodhead - Molex	CONN RCPT 8POS 0.1 TIN PCB	4106
5023821270 Woodhead - Molex	CONN RCPT 12POS 0.049 TIN SMD	1175
0015445820 Woodhead - Molex	CONN RCPT 20POS 0.1 GOLD PCB	123
5023861370 Woodhead - Molex	CONN RCPT 13P 0.049 TIN SMD R/A	0
5023820571 Woodhead - Molex	CONN RCPT 5POS 0.049 GOLD SMD	8397
0015247187 Woodhead - Molex	CONN RCPT 18POS 0.165 GOLD PCB	0
0447642202 Woodhead - Molex	CONN RCPT 22P 0.118 GOLD PCB R/A	0
0038001338 Woodhead - Molex	CONN RCPT 8POS 0.1 TIN EDGE MNT	1499
5031750500 Woodhead - Molex	CONN RCPT 5POS 0.059 TIN PCB R/A	58573520
0447640602 Woodhead - Molex	CONN RCPT 6P 0.118 GOLD PCB R/A	715
0015453514 Woodhead - Molex	CONN RCPT 14POS 0.1 GOLD SMD	1255
0009483044 Woodhead - Molex	CONN RCPT 4POS 0.156 GOLD PCB	132
0009481104 Woodhead - Molex	CONN RCPT 10P 0.156 TIN EDGE MNT	157
0010101051 Woodhead - Molex	CONN RCPT 5POS 0.2 TIN EDGE MNT	396
0447692202 Woodhead - Molex	CONN RCPT 22POS 0.118 GOLD PCB	0

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers