Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
0009484039 Woodhead - Molex	CONN RCPT 3POS 0.156 TIN PCB	1591
5023860471 Woodhead - Molex	CONN RCPT 4P 0.049 GOLD SMD R/A	4086
0010845031 Woodhead - Molex	CONN HDR 3POS 0.25 TIN PCB	4736
0015247107 Woodhead - Molex	CONN RCPT 10POS 0.165 GOLD PCB	0
0791091002 Woodhead - Molex	CONN RCPT 6POS 0.079 GOLD SMD	1679
0015247040 Woodhead - Molex	CONN RCPT 4POS 0.165 TIN PCB	2119
0022162060 Woodhead - Molex	CONN RCPT 6POS 0.1 GOLD EDGE MNT	332
0872630893 Woodhead - Molex	CONN RCPT 8POS 0.079 GOLD SMD	5727
0015247061 Woodhead - Molex	CONN RCPT 6POS 0.165 TIN PCB	0
5031750200 Woodhead - Molex	CONN RCPT 2POS 0.059 TIN PCB R/A	5731
0873684224 Woodhead - Molex	CONN RCPT 42P 0.079 GOLD SMD R/A	0
0022173052 Woodhead - Molex	CONN RCPT 5POS 0.1 GOLD PCB	410
0791091001 Woodhead - Molex	CONN RCPT 4POS 0.079 GOLD SMD	11456
0010844062 Woodhead - Molex	CONN HDR 6POS 0.25 TIN PCB	915
0791098604 Woodhead - Molex	CONN RCPT 10POS 0.079 GOLD SMD	2138
0010844032 Woodhead - Molex	CONN HDR 3POS 0.25 TIN PCB	10381
0010844122 Woodhead - Molex	CONN HDR 12POS 0.25 TIN PCB	1568
0873683224 Woodhead - Molex	CONN RCPT 32P 0.079 GOLD SMD R/A	0
5025840770 Woodhead - Molex	CONN RCPT 7POS 0.059 TIN SMD	1380
2132271011 Woodhead - Molex	CLIK-MATE1.5 DRVT SMT AU0.1 ETP	0

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers