Rectangular Connectors - Headers, Receptacles, Female Sockets

Part Number	Description / PDF	Quantity
5025840670 Woodhead - Molex	CONN RCPT 6POS 0.059 TIN SMD	883
0015247241 Woodhead - Molex	CONN RCPT 24POS 0.165 TIN PCB	368
0022022075 Woodhead - Molex	CONN RCPT 7POS 0.1 TIN PCB	3892
0447642003 Woodhead - Molex	CONN RCPT 20P 0.118 GOLD PCB R/A	0
0010181042 Woodhead - Molex	CONN HDR 4POS 0.198 TIN PCB	0
5054051470 Woodhead - Molex	CONN RCPT 14POS 0.059 GOLD SMD	0
0015247101 Woodhead - Molex	CONN RCPT 10POS 0.165 TIN PCB	171
0015453216 Woodhead - Molex	CONN RCPT 16POS 0.1 TIN SMD	99
0901522120 Woodhead - Molex	CONN RCPT 20POS 0.1 TIN PCB R/A	834
0791077001 Woodhead - Molex	CONN RCPT 4POS 0.079 GOLD PCB	1602
0022182121 Woodhead - Molex	CONN RCPT 12POS 0.1 GOLD PCB	129
0448120010 Woodhead - Molex	CONN RCPT 10POS 0.1 TIN PCB	0
0448120004 Woodhead - Molex	CONN RCPT 4POS 0.1 TIN PCB	0
2132260210 Woodhead - Molex	CONN RECPT R/A SMC 2 POS	868
0791091010 Woodhead - Molex	CONN RCPT 22POS 0.079 GOLD SMD	1409
5031541290 Woodhead - Molex	CONN RCPT 12POS 0.059 TIN SMD	2890
5031751400 Woodhead - Molex	CONN RCPT 14P 0.059 TIN PCB R/A	999
0022162090 Woodhead - Molex	CONN RCPT 9POS 0.1 GOLD EDGE MNT	0
0873682224 Woodhead - Molex	CONN RCPT 22P 0.079 GOLD SMD R/A	0
5031750400 Woodhead - Molex	CONN RCPT 4POS 0.059 TIN PCB R/A	49414

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers