Rectangular Connectors - Headers, Receptacles, Female Sockets

Image	Part Number	Description / PDF	Quantity	Rfq
	MTB2-3SL1 VEAM	MTB2-3SL1	0
	130410-0001 VEAM	SLEB19N3PM	0
	192991-0533 VEAM	TRI SLMLNE 4 CONT RECT RANG AU	0
	192991-0246 VEAM	TRI SNAP 12 SKT REC PCB TIN MC	0
	MTB1-7SAL61-1 VEAM	MICRO 7C SKT .125 GUIDEP	0
	RMTB1-12PL61 VEAM	MICRO STRIP 12 PIN .125"	0
	MTB1-15SL2 VEAM	MICRO 15 F 1.0" UNINS	0
	MTB2-31SL79 VEAM	096661-0000	0
	192991-0238 VEAM	TRI SNAP 6 SKT RECP PCB TIN MC	0
	192991-0261 VEAM	TRI SNAP 36 SKT REC PCB GLD MC	0
	192991-0229 VEAM	TRI SNAP 4 SKT RECP PCB GLD MC	0
	192991-0254 VEAM	TRI SNAP 24 SKT REC PCB TIN MC	0
	192990-3330 VEAM	TRI SNAP 6 SKT RECP PCB TIN ST	0
	MTB-7SL82 VEAM	MICROSTRIP 7C SKT	0
	MTV1-20SL1 VEAM	CONN 20POS 0.05 GOLD PCB	0
	130410-0000 VEAM	SLEB19N3P	0
	130411-0000 VEAM	SLEB19T3P	0
	192991-0222 VEAM	TRI SNAP 3 SKT RECP PCB TIN MC	0
	MTV1-16SL1-01 VEAM	MICRO 16 F .50" UNINS	0
	192900-0421 VEAM	TRI SNAP 6 SKT RECP PCB GLD ST	0

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Single-Row Headers	Linear arrangement of male pins	Arduino shields, sensor modules
Double-Row Headers	Dual-row pin configuration for higher density	Computer motherboards, industrial controllers
Right-Angle Receptacles	90 orientation for space-constrained designs	Compact medical devices, automotive sensors
Stacking Female Sockets	Vertical interconnection for multi-board systems	3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

Parameter	Value/Range	Importance
Current Rating	0.5A - 10A per contact	Determines power transmission capacity
Contact Resistance	5-20m	Affects signal integrity and thermal performance
Dielectric Strength	500V - 2500V AC	Ensures electrical safety and insulation reliability
Operating Temperature	-55 C to +125 C	Defines environmental tolerance
Mating Cycles	100 - 10,000 cycles	Indicates mechanical durability

5. Application Fields

Consumer Electronics: Smartphones, laptops, gaming consoles
Industrial Automation: PLCs, motor drives, sensor hubs
Telecommunications: 5G base stations, network routers
Medical Devices: Diagnostic equipment, patient monitors
Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

Manufacturer	Representative Product
TE Connectivity	MicroSpeed Rectangular Connectors
Molex	PicoBlade 0.8mm Headers
Amphenol	MICRO CONECTA Surface Mount Sockets
Samtec	QTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

Electrical requirements (current/voltage levels)
PCB space constraints and stacking needs
Environmental factors (temperature, vibration, moisture)
Cost-effectiveness vs. long-term reliability
Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

Miniaturization: Sub-1.0mm pitch connectors for wearable devices
High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
Enhanced reliability: Hermetic sealing for aerospace applications
Modular designs: Tool-less hot-swap systems for data centers