Rectangular Connectors - Headers, Receptacles, Female Sockets

Image Part Number Description / PDF Quantity Rfq
130414-0002

130414-0002

VEAM

SLEC28N3PN

0

MTB2-12SL80

MTB2-12SL80

VEAM

MICRO 12C SKT

0

RMTB1-8SAL61-02

RMTB1-8SAL61-02

VEAM

MICROSTRIP 8C SKT RA .125"

0

MTB1-6SL92

MTB1-6SL92

VEAM

MICRO 6 SKT PLASTIC

0

192900-0422

192900-0422

VEAM

TRI SNAP 12 SKT REC PCB GLD ST

0

MTB1-5SL1

MTB1-5SL1

VEAM

MTB1-5SL1

0

130410-0002

130410-0002

VEAM

SLEB19N3PN

0

192991-0230

192991-0230

VEAM

TRI SNAP 4 SKT RECP PCB GLD MC

0

192990-3340

192990-3340

VEAM

TRI SNAP 12 SKT RECP PCB TIN S

0

MTV1-48SL1

MTV1-48SL1

VEAM

097503-0003

0

130415-0004

130415-0004

VEAM

SLEB28T3PE

0

MTV1-15SL84

MTV1-15SL84

VEAM

097437-0014

0

192991-0532

192991-0532

VEAM

TRI SLMLNE 3 CONT RECT RANG AU

0

192991-0414

192991-0414

VEAM

TRI SNAP 12 SKT REC PCB GLD ST

0

MTB2-20SL58

MTB2-20SL58

VEAM

096639-0001

0

MTV1-25SAL57

MTV1-25SAL57

VEAM

MICRO 25C SKT

0

130415-0002

130415-0002

VEAM

SLEC28T3PN

0

192991-0253

192991-0253

VEAM

CONN RCPT 24POS 0.2 GOLD PCB

0

192900-0424

192900-0424

VEAM

TRI SNAP 36 SKT REC PCB GLD ST

0

192990-3360

192990-3360

VEAM

TRI SNAP 36 SKT REC PCB TIN ST

0

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Single-Row HeadersLinear arrangement of male pinsArduino shields, sensor modules
Double-Row HeadersDual-row pin configuration for higher densityComputer motherboards, industrial controllers
Right-Angle Receptacles90 orientation for space-constrained designsCompact medical devices, automotive sensors
Stacking Female SocketsVertical interconnection for multi-board systems3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

  • Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
  • Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
  • Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
  • Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

ParameterValue/RangeImportance
Current Rating0.5A - 10A per contactDetermines power transmission capacity
Contact Resistance5-20m Affects signal integrity and thermal performance
Dielectric Strength500V - 2500V ACEnsures electrical safety and insulation reliability
Operating Temperature-55 C to +125 CDefines environmental tolerance
Mating Cycles100 - 10,000 cyclesIndicates mechanical durability

5. Application Fields

  • Consumer Electronics: Smartphones, laptops, gaming consoles
  • Industrial Automation: PLCs, motor drives, sensor hubs
  • Telecommunications: 5G base stations, network routers
  • Medical Devices: Diagnostic equipment, patient monitors
  • Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityMicroSpeed Rectangular Connectors
MolexPicoBlade 0.8mm Headers
AmphenolMICRO CONECTA Surface Mount Sockets
SamtecQTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

  • Electrical requirements (current/voltage levels)
  • PCB space constraints and stacking needs
  • Environmental factors (temperature, vibration, moisture)
  • Cost-effectiveness vs. long-term reliability
  • Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

  • Miniaturization: Sub-1.0mm pitch connectors for wearable devices
  • High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
  • Enhanced reliability: Hermetic sealing for aerospace applications
  • Modular designs: Tool-less hot-swap systems for data centers
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