Rectangular Connectors - Headers, Receptacles, Female Sockets

Image Part Number Description / PDF Quantity Rfq
MTB1-14SL201

MTB1-14SL201

VEAM

MICRO PLASTIC 14 SKT

0

MTB2-12SBL57

MTB2-12SBL57

VEAM

MICRO 12C SKT L57

0

192900-0423

192900-0423

VEAM

TRI SNAP 24 SKT REC PCB GLD ST

0

130411-0001

130411-0001

VEAM

SLEB19T3PM

0

191991-0534

191991-0534

VEAM

TRI SLMLNE 6 CONT RECT RANG AU

0

RMTB1-2SAL61

RMTB1-2SAL61

VEAM

MICROSTRIP 2C SKT RA .125"

0

MTB1-20SL

MTB1-20SL

VEAM

MTB1-20SL

0

MTB-10SL1

MTB-10SL1

VEAM

MTB-10SL1

0

130411-0006

130411-0006

VEAM

SLEB19T3PE

0

130415-0001

130415-0001

VEAM

SLEB28T3P

0

MTB1-23SL1-01

MTB1-23SL1-01

VEAM

MICRO 23 F .50" UNINS

0

RMTB1-6SAL61-02

RMTB1-6SAL61-02

VEAM

MICROSTRIP 6C SKT RA .125"

0

MTV1-16SL1

MTV1-16SL1

VEAM

MICRO 16 F .50" UNINS

0

192991-0534

192991-0534

VEAM

TRI SLMLNE 6 CONT RECT RANG AU

0

MTV1-32SL1-01

MTV1-32SL1-01

VEAM

MICRO 32 F .50" UNINS

0

192991-0535

192991-0535

VEAM

TRI SLMLNE 9 CONT RECT RANG AU

0

130414-0001

130414-0001

VEAM

SLEC28N3PM

0

MTB2-21SL79

MTB2-21SL79

VEAM

096641-0000

0

192991-0221

192991-0221

VEAM

TRI SNAP 3 SKT RECP PCB GLD MC

0

130411-0002

130411-0002

VEAM

SLEB19T3PN

0

Rectangular Connectors - Headers, Receptacles, Female Sockets

1. Overview

Rectangular connectors are modular electrical components designed to establish reliable connections between PCBs (Printed Circuit Boards) or electronic systems. This category includes headers (male pins), receptacles (female contacts), and sockets, which enable signal/power transmission while maintaining mechanical stability. Their standardized designs and versatility make them critical in modern electronics, from consumer devices to industrial machinery.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Single-Row HeadersLinear arrangement of male pinsArduino shields, sensor modules
Double-Row HeadersDual-row pin configuration for higher densityComputer motherboards, industrial controllers
Right-Angle Receptacles90 orientation for space-constrained designsCompact medical devices, automotive sensors
Stacking Female SocketsVertical interconnection for multi-board systems3D printer control stacks, test equipment

3. Structure and Components

Typical construction includes:

  • Contact Terminals: Phosphor bronze or beryllium copper with gold/tin plating for conductivity
  • Insulation Housing: Thermoplastic materials (e.g., LCP, Nylon 6/6) for dielectric strength
  • Retention Mechanism: Polarization keys and locking tabs to prevent misalignment
  • Mounting Options: Through-hole or surface-mount (SMT) configurations

4. Key Technical Specifications

ParameterValue/RangeImportance
Current Rating0.5A - 10A per contactDetermines power transmission capacity
Contact Resistance5-20m Affects signal integrity and thermal performance
Dielectric Strength500V - 2500V ACEnsures electrical safety and insulation reliability
Operating Temperature-55 C to +125 CDefines environmental tolerance
Mating Cycles100 - 10,000 cyclesIndicates mechanical durability

5. Application Fields

  • Consumer Electronics: Smartphones, laptops, gaming consoles
  • Industrial Automation: PLCs, motor drives, sensor hubs
  • Telecommunications: 5G base stations, network routers
  • Medical Devices: Diagnostic equipment, patient monitors
  • Automotive: ECU connectors, ADAS sensors

6. Leading Manufacturers and Products

ManufacturerRepresentative Product
TE ConnectivityMicroSpeed Rectangular Connectors
MolexPicoBlade 0.8mm Headers
AmphenolMICRO CONECTA Surface Mount Sockets
SamtecQTRADE High-Speed Receptacles

7. Selection Guidelines

Key considerations:

  • Electrical requirements (current/voltage levels)
  • PCB space constraints and stacking needs
  • Environmental factors (temperature, vibration, moisture)
  • Cost-effectiveness vs. long-term reliability
  • Compliance with standards (IPC, RoHS, REACH)

Example: For automotive applications, prioritize connectors with high vibration resistance (e.g., TE Connectivity's AMPMODU series) and AEC-Q200 certification.

8. Industry Trends

Emerging directions include:

  • Miniaturization: Sub-1.0mm pitch connectors for wearable devices
  • High-speed capabilities: 10+ Gbps data rates for 5G infrastructure
  • Enhanced reliability: Hermetic sealing for aerospace applications
  • Modular designs: Tool-less hot-swap systems for data centers
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