Modular Connectors

Modular Connectors - Jacks

Part Number	Description / PDF	Quantity
SS-641010-A-NF-A111 Stewart Connector	CONN MOD JACK 10P10C R/A UNSHLD	0
SS-801010SB-SP50-040-250 Stewart Connector	CONN MOD JACK 10P10C UNSHIELDED	1837
RJSAE508502 Storage & Server IO (Amphenol ICC)	CONN MOD JACK 8P8C R/A UNSHLD	99
GSGX-NS2-488-36850 Kycon	G/JK 4PT RT< 8P8C SHL L/GT BLK 3	0
GSX-NS2-88-4.57 Kycon	MODJACK RT< 8P8C SHIELD LG GT 4.	0
TM5RL-88(50) Hirose	CONN MOD JACK 8P8C R/A UNSHLD	0
TM2RE-2408(50) Hirose	CONN MOD JACK 6P2C VERT UNSHLD	0
5-1775855-1 TE Connectivity AMP Connectors	CONN MOD JACK 8P8C R/A SHIELDED	795
GWGX-S1-2-88 Kycon	2 PORT 8P8C MOD JACK, SHIELDED,	0
0441440013 Woodhead - Molex	CONN MOD JACK 8P8C R/A UNSHLD	0
GDLX-S-66 Kycon	MODJK LOW/PROF RT< 6P6C P/S SHIE	0
1963460000 Weidmuller	CONN MOD JACK 8P8C SHIELDED	6
TM23R-5A-88(50) Hirose	CONN MOD JACK 8P8C R/A UNSHLD	52
RJSAE-5381-02 Storage & Server IO (Amphenol ICC)	CONN MOD JACK 8P8C R/A SHIELDED	1389
6116522-1 TE Connectivity AMP Connectors	CONN MOD JACK 8P8C R/A SHIELDED	0
ENSP1F5C305 Quatech / B+B SmartWorx	BACKSIDE 12 PATCH CORD	59
RJE71-188-1411 Storage & Server IO (Amphenol ICC)	CONN MOD JACK 8P8C R/A SHIELDED	586
5406533-1 TE Connectivity AMP Connectors	CONN MOD JACK 8P8C R/A UNSHLD	5897
TM5RJ1-66(50) Hirose	CONN MOD JACK 6P6C R/A UNSHLD	984
SS-74810-001 Stewart Connector	CONN MOD JACK 1PORT W/LED	382

Modular Connectors - Jacks

1. Overview

Modular connectors-jacks are standardized electro-mechanical interfaces used for connecting cables in telecommunications, data networks, and electronic systems. Their hot-swappable design and standardized dimensions enable rapid deployment and maintenance. These connectors maintain signal integrity while providing mechanical strain relief, playing critical roles in network infrastructure, consumer electronics, and industrial equipment.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
RJ11	6-position 2-conductor design, voice-grade transmission	Residential telephone lines
RJ45	8-position 8-conductor, supports up to 10GBASE-T Ethernet	LAN switches/routers
USB Type-A	Rectangular interface with 4-24 pins, supports USB 3.2 Gen2	Computer peripherals
HDMI	19-pin configuration, transmits uncompressed video/audio	Home theaters/monitors
Fiber LC	Duplex optical interface, supports 100Gbps+ transmission	Data center backbone

3. Structure and Components

Typical construction includes: - Insulating housing (high-temp thermoplastic) - Conductive contacts (phosphor bronze with gold plating) - Latch retention mechanism - Wire termination points (IDC or solder) - EMI shielding layer The modular design allows tool-less installation while maintaining mechanical stability through polarization keys and retention clips.

4. Key Technical Specifications

Parameter	Typical Values	Importance
Insertion Loss	<0.5dB @100MHz	Signal quality preservation
Durability	750-2000 mating cycles	Long-term reliability
Contact Resistance	10-30m	Power transmission efficiency
Insulation Resistance	>500M	Electrical safety
Operating Temp	-40 C to +85 C	Environmental adaptability

5. Application Fields

Telecom: PBX systems, DSL modems
IT Infrastructure: Server racks, PoE devices
Consumer Electronics: Smart TVs, gaming consoles
Industrial: PLC controllers, SCADA systems
Automotive: Telematics control units

6. Leading Manufacturers and Products

Manufacturer	Key Products
TE Connectivity	Category 8 RJ45 modules
Amphenol	Military-spec circular connectors
Molex	Optical LC duplex adapters
Delphi	Automotive-grade sealed jacks

7. Selection Guidelines

Key considerations: - Transmission speed requirements (e.g., Cat6a vs Cat8) - Environmental factors (temperature/humidity/vibration) - Mating cycle expectations - Shielding requirements (FTP vs UTP) - Backward compatibility needs - Cost vs performance trade-offs

8. Industry Trends

Development directions include: - 400Gbps+ optical interfaces - 0.8mm pitch miniaturization - Smart connectors with built-in sensors - PoE++ (90W+) capability integration - Bio-based polymer materials adoption The global market is projected to grow at 6.2% CAGR through 2030 driven by 5G and IoT deployments.