Modular Connectors - Jacks

Image Part Number Description / PDF Quantity Rfq
SS-650810-A-NF

SS-650810-A-NF

Stewart Connector

CONN MOD JACK 8P8C VERT UNSHLD

0

5569118-1

5569118-1

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A UNSHLD

1581

RJSAE538008

RJSAE538008

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A SHIELDED

90

1734324-3

1734324-3

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHIELDED

3180

5520241-2

5520241-2

TE Connectivity AMP Connectors

CONN MOD JACK 4P4C R/A UNSHLD

2608

GLX-N-88M-50

GLX-N-88M-50

Kycon

MODJACK LOW/PROF RT< 8P8C GREY 5

0

1827585-1

1827585-1

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHIELDED

0

SS-7188S-A-PG4-1-BA

SS-7188S-A-PG4-1-BA

Stewart Connector

CONN MOD JACK 8P8C R/A SHIELDED

5344

MTJG-2-88ARX1C-LE

MTJG-2-88ARX1C-LE

Adam Tech

GANGED MODULAR JACK 1*2PORT 8P8C

0

SS-6488-NF-A431

SS-6488-NF-A431

Stewart Connector

CONN MOD JACK 8P8C R/A UNSHLD

0

TM2RE-0602(50)

TM2RE-0602(50)

Hirose

CONN MOD JACK 6P2C VERT UNSHLD

0

SS70100-023F

SS70100-023F

Stewart Connector

CONN MOD JACK 10P10C R/A SHLD

0

MTJ-88TX1-LP

MTJ-88TX1-LP

Adam Tech

RJ45 MODULAR JACK, DIP, SIDE ENT

240

5558310-1

5558310-1

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHIELDED

319

GSX-NS-88-3.68

GSX-NS-88-3.68

Kycon

MODJACK RT< 8P8C SHIELD BLK 3.68

0

5555154-2

5555154-2

TE Connectivity AMP Connectors

CONN MOD JACK 6P4C R/A SHIELDED

1035

32-2038

32-2038

Vitelec / Cinch Connectivity Solutions

CONN MOD JACK 8P8C R/A UNSHLD

82

4434

4434

Adafruit

RJ12 JACK EV3/NXT LEGO COMP 10PK

30

RJFTV6A7SA5NF459

RJFTV6A7SA5NF459

Socapex (Amphenol Pcd)

RJ FIELD TV CAT6A JAM NUT RECEPT

25

0442480033

0442480033

Woodhead - Molex

CONN MOD JACK 8P8C R/A SHIELDED

80

Modular Connectors - Jacks

1. Overview

Modular connectors-jacks are standardized electro-mechanical interfaces used for connecting cables in telecommunications, data networks, and electronic systems. Their hot-swappable design and standardized dimensions enable rapid deployment and maintenance. These connectors maintain signal integrity while providing mechanical strain relief, playing critical roles in network infrastructure, consumer electronics, and industrial equipment.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ116-position 2-conductor design, voice-grade transmissionResidential telephone lines
RJ458-position 8-conductor, supports up to 10GBASE-T EthernetLAN switches/routers
USB Type-ARectangular interface with 4-24 pins, supports USB 3.2 Gen2Computer peripherals
HDMI19-pin configuration, transmits uncompressed video/audioHome theaters/monitors
Fiber LCDuplex optical interface, supports 100Gbps+ transmissionData center backbone

3. Structure and Components

Typical construction includes: - Insulating housing (high-temp thermoplastic) - Conductive contacts (phosphor bronze with gold plating) - Latch retention mechanism - Wire termination points (IDC or solder) - EMI shielding layer The modular design allows tool-less installation while maintaining mechanical stability through polarization keys and retention clips.

4. Key Technical Specifications

ParameterTypical ValuesImportance
Insertion Loss<0.5dB @100MHzSignal quality preservation
Durability750-2000 mating cyclesLong-term reliability
Contact Resistance10-30m Power transmission efficiency
Insulation Resistance>500M Electrical safety
Operating Temp-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecom: PBX systems, DSL modems
  • IT Infrastructure: Server racks, PoE devices
  • Consumer Electronics: Smart TVs, gaming consoles
  • Industrial: PLC controllers, SCADA systems
  • Automotive: Telematics control units

6. Leading Manufacturers and Products

ManufacturerKey Products
TE ConnectivityCategory 8 RJ45 modules
AmphenolMilitary-spec circular connectors
MolexOptical LC duplex adapters
DelphiAutomotive-grade sealed jacks

7. Selection Guidelines

Key considerations: - Transmission speed requirements (e.g., Cat6a vs Cat8) - Environmental factors (temperature/humidity/vibration) - Mating cycle expectations - Shielding requirements (FTP vs UTP) - Backward compatibility needs - Cost vs performance trade-offs

8. Industry Trends

Development directions include: - 400Gbps+ optical interfaces - 0.8mm pitch miniaturization - Smart connectors with built-in sensors - PoE++ (90W+) capability integration - Bio-based polymer materials adoption The global market is projected to grow at 6.2% CAGR through 2030 driven by 5G and IoT deployments.

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