Modular Connectors - Jacks

Image Part Number Description / PDF Quantity Rfq
TM2REA-1806(50)

TM2REA-1806(50)

Hirose

CONN MOD JACK 6P2C R/A UNSHLD

0

CJ88IWY

CJ88IWY

Panduit Corporation

CONN MOD JACK 8P8C UNSHIELDED

0

RJE051880310

RJE051880310

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A UNSHLD

300

SS-60300-011

SS-60300-011

Stewart Connector

RIGHT ANGLE SHIELDED JACK WITH E

456

A00-432-660-450

A00-432-660-450

EDAC Inc.

CONN MOD JACK 8P8C R/A UNSHLD

0

1-1734858-3

1-1734858-3

TE Connectivity AMP Connectors

CONN MOD JACK 6P6C VERT UNSHLD

246

RJE72-488-14A1

RJE72-488-14A1

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C R/A SHIELDED

0

E5J88-00AJG2-L

E5J88-00AJG2-L

PulseLarsen Antenna

CONN MOD JACK 8P8C R/A UNSHLD

2224

SS-60000-009

SS-60000-009

Stewart Connector

CONN MOD JACK 8P8C R/A SHIELDED

3398

SS-6488-FLS

SS-6488-FLS

Stewart Connector

CONN MOD JACK 8P8C R/A UNSHLD

1451

GWX-N-88-50

GWX-N-88-50

Kycon

8P8C MOD JACK 50U ROHS COMPLIANT

0

0438600026

0438600026

Woodhead - Molex

CONN MOD JACK 6P6C R/A SHIELDED

935

2170358-1

2170358-1

TE Connectivity AMP Connectors

CONN MOD JACK 8P8C R/A SHIELDED

0

94152-088LF

94152-088LF

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 8P8C VERT SHIELDED

0

RJE0166201

RJE0166201

Storage & Server IO (Amphenol ICC)

CONN MOD JACK 6P6C R/A SHIELDED

9692

615016149521

615016149521

Würth Elektronik Midcom

CONN MOD JACK 8P8C R/A UNSHLD

17

EB-RJF-BLKHD-1

EB-RJF-BLKHD-1

Red Lion

CONN MOD JACK 8P8C UNSHLD

0

RV6IJ2UBL-B24

RV6IJ2UBL-B24

Belden

JACK CAT 6 UTP RJ45 BLU 1=24

3

0950097661

0950097661

Woodhead - Molex

CONN MOD JACK 6P6C R/A UNSHLD

3744

GSGX-NS-4-88-4.57

GSGX-NS-4-88-4.57

Kycon

GANGJACK 4PORT RT< 8P8C 4.57 SHI

0

Modular Connectors - Jacks

1. Overview

Modular connectors-jacks are standardized electro-mechanical interfaces used for connecting cables in telecommunications, data networks, and electronic systems. Their hot-swappable design and standardized dimensions enable rapid deployment and maintenance. These connectors maintain signal integrity while providing mechanical strain relief, playing critical roles in network infrastructure, consumer electronics, and industrial equipment.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ116-position 2-conductor design, voice-grade transmissionResidential telephone lines
RJ458-position 8-conductor, supports up to 10GBASE-T EthernetLAN switches/routers
USB Type-ARectangular interface with 4-24 pins, supports USB 3.2 Gen2Computer peripherals
HDMI19-pin configuration, transmits uncompressed video/audioHome theaters/monitors
Fiber LCDuplex optical interface, supports 100Gbps+ transmissionData center backbone

3. Structure and Components

Typical construction includes: - Insulating housing (high-temp thermoplastic) - Conductive contacts (phosphor bronze with gold plating) - Latch retention mechanism - Wire termination points (IDC or solder) - EMI shielding layer The modular design allows tool-less installation while maintaining mechanical stability through polarization keys and retention clips.

4. Key Technical Specifications

ParameterTypical ValuesImportance
Insertion Loss<0.5dB @100MHzSignal quality preservation
Durability750-2000 mating cyclesLong-term reliability
Contact Resistance10-30m Power transmission efficiency
Insulation Resistance>500M Electrical safety
Operating Temp-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecom: PBX systems, DSL modems
  • IT Infrastructure: Server racks, PoE devices
  • Consumer Electronics: Smart TVs, gaming consoles
  • Industrial: PLC controllers, SCADA systems
  • Automotive: Telematics control units

6. Leading Manufacturers and Products

ManufacturerKey Products
TE ConnectivityCategory 8 RJ45 modules
AmphenolMilitary-spec circular connectors
MolexOptical LC duplex adapters
DelphiAutomotive-grade sealed jacks

7. Selection Guidelines

Key considerations: - Transmission speed requirements (e.g., Cat6a vs Cat8) - Environmental factors (temperature/humidity/vibration) - Mating cycle expectations - Shielding requirements (FTP vs UTP) - Backward compatibility needs - Cost vs performance trade-offs

8. Industry Trends

Development directions include: - 400Gbps+ optical interfaces - 0.8mm pitch miniaturization - Smart connectors with built-in sensors - PoE++ (90W+) capability integration - Bio-based polymer materials adoption The global market is projected to grow at 6.2% CAGR through 2030 driven by 5G and IoT deployments.

RFQ BOM Call Skype Email
Top