Memory Connectors - Accessories

Image Part Number Description / PDF Quantity Rfq
1510730011

1510730011

Woodhead - Molex

TRAY FOR NANO SIM CONN WDPDC M45

0

1510500001

1510500001

Woodhead - Molex

DUAL SIM FRAME WDETECT PIN 137MM

0

62365-101

62365-101

Storage & Server IO (Amphenol ICC)

CF CARD KIT SEMI

0

NX1BL-32T-KT9B(05)

NX1BL-32T-KT9B(05)

Hirose

CONN CARD BUS FRAME 32POS 0.9MM

0

78242-002LF

78242-002LF

Storage & Server IO (Amphenol ICC)

LATCH FOR FLYING-CONNECTION-SR

0

IC11SA-BD-L

IC11SA-BD-L

Hirose

CONN EJECTOR GUIDE

0

C702 N15 100 G2

C702 N15 100 G2

Tuchel / Amphenol

MOUNTING PLATE

0

C702 N14 000 G2

C702 N14 000 G2

Tuchel / Amphenol

SHUTTER

0

558790-2

558790-2

TE Connectivity AMP Connectors

CONN ACCESSORY SHIELD KIT 15 POS

0

0912360001

0912360001

Woodhead - Molex

CONN CARD HOLDER SIM 6POS VERT

0

C702 G46 201 G2

C702 G46 201 G2

Tuchel / Amphenol

METAL BEZEL W/COIN SPACER

0

83808-20110LF

83808-20110LF

Storage & Server IO (Amphenol ICC)

CONN SHIELD W/INSUL&LABEL RECESS

0

10030582-0000LF

10030582-0000LF

Storage & Server IO (Amphenol ICC)

CONN EXPRESSCARD/54 MODULE BOTTM

0

558790-1

558790-1

TE Connectivity AMP Connectors

CONN ACCESSORY SHIELD KIT 15 POS

0

5535664-1

5535664-1

TE Connectivity AMP Connectors

MEMCD GUIDE RL STD LFT W/HDWN

0

10030574-0010LF

10030574-0010LF

Storage & Server IO (Amphenol ICC)

CONN EXPRESSCARD/34 MODULE BOTTM

0

2134033-1

2134033-1

TE Connectivity AMP Connectors

TS14-RVS TRAY

0

IC15A-G-PEJL

IC15A-G-PEJL

Hirose

CONN ACCESSY IC15A PC CARD GUIDE

0

5146035-2

5146035-2

TE Connectivity AMP Connectors

MEMCD STKD RGT GUIDE RL W/HDWN

0

558665-1

558665-1

TE Connectivity AMP Connectors

CONN CABLE COVER 15 POS BLACK

0

Memory Connectors - Accessories

1. Overview

Memory connectors and accessories are critical components that enable electrical and mechanical connections between memory modules (e.g., RAM, SSDs) and host systems. They ensure reliable signal transmission, power delivery, and mechanical stability in electronic devices. With advancements in computing performance and miniaturization trends, these components have become essential in applications ranging from consumer electronics to industrial systems.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
DIMM Connectors64-bit data path, ZIF (Zero Insertion Force) designDesktop PCs, Servers
SO-DIMM ConnectorsSmaller form factor, 200/260-pin configurationsLaptops, Embedded Systems
U-DIMM ConnectorsUnbuffered memory support, low-latency performanceGaming PCs, Workstations
SIMM Connectors32-bit data path, legacy technologyOlder Servers, Industrial Equipment
RIMM ConnectorsRDRAM-compatible, high-speed signalingLegacy High-Performance Computing

3. Structure & Components

Typical memory connectors consist of:

  • Contact pins (phosphor bronze with gold plating for conductivity)
  • Insulating housing (LCP/LPA material for thermal stability)
  • Actuator mechanism (for ZIF connectors)
  • EMI shielding (for high-frequency applications)
  • Retention clips (mechanical stabilization)

4. Key Technical Specifications

ParameterValue/RangeImportance
Contact Resistance5-20 m Affects signal integrity
Current Rating1-3 A/pinDetermines power capacity
Dielectric Withstanding Voltage500 VACSafety and reliability
Operating Temperature-55 C to +125 CEnvironmental durability
Insertion Force20-50NAffects lifespan
Signal IntegritySupports up to 8 GT/sEnables high-speed memory

5. Application Fields

  • Computer Hardware: Motherboards, Graphics Cards
  • Data Centers: Servers, Storage Arrays
  • Consumer Electronics: Smartphones, Tablets
  • Industrial Equipment: Automation Controllers
  • Telecommunications: Routers, Base Stations

6. Leading Manufacturers & Products

ManufacturerRepresentative Products
TE ConnectivityDDR4 DIMM Connectors, SATA Power Connectors
Amphenol ICCHigh-Speed SO-DIMM Sockets
MolexDDR5 U-DIMM Connectors
SamtecHigh-Frequency Memory Arrays
JAE ElectronicsCompact R-DIMM Solutions

7. Selection Guidelines

Key factors to consider:

  • Compatibility with memory standard (DDR3/DDR4/DDR5)
  • Environmental requirements (temperature, vibration)
  • Electrical performance requirements
  • Space constraints (form factor limitations)
  • Cost vs. reliability trade-offs
  • Compliance with industry standards (JEDEC, IPC)

8. Industry Trends Analysis

Current development trends include:

  • Transition to DDR5/LPDDR5X standards with 8 GT/s+ data rates
  • Miniaturization for mobile and IoT applications
  • Integrated power delivery (Power & Signal in single connector)
  • Advanced thermal management solutions
  • Increased use of press-fit terminations
  • Development of optical memory interconnects

Application Case: In high-density servers, TE Connectivity's DDR4 connectors enable 3200 MT/s memory speeds while maintaining signal integrity below 12 m resistance. For automotive applications, Amphenol's ruggedized SO-DIMM connectors meet AEC-Q100 reliability standards.

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