Memory Connectors - Accessories

Image Part Number Description / PDF Quantity Rfq
7E50-C016-00

7E50-C016-00

3M

CF CARD EJECT/LATCHING RETAINER

2752

09455002802

09455002802

HARTING

CRIMP TERMINATION, AWG 24/7 AWG

825

NX1BL-25T-KT3B(05)

NX1BL-25T-KT3B(05)

Hirose

CONN CARD BUS FRAME 25POS 0.3MM

0

10042618-004HLF

10042618-004HLF

Storage & Server IO (Amphenol ICC)

CONN ACCY CARD RETENTION

0

0895000023

0895000023

Woodhead - Molex

UP LID PCMCIA ABS BLK

0

558665-2

558665-2

TE Connectivity AMP Connectors

CONN CABLE COVER 15 POS BLACK

0

NX-15T-CV1

NX-15T-CV1

Hirose

CONN PLUG COVER 15POS VERT OPEN

0

10136313-001

10136313-001

Storage & Server IO (Amphenol ICC)

DDR4 DUST CAP ASM

0

NX1-15T-KT9K(05)

NX1-15T-KT9K(05)

Hirose

CONN FRAME KIT 15POS 0.9MM 5V

0

62380-001

62380-001

Storage & Server IO (Amphenol ICC)

CF CARD KIT SEMI

0

TBT69

TBT69

Belden

STRAIN RELIEF KIT

0

62379-002

62379-002

Storage & Server IO (Amphenol ICC)

CF CARD KIT SEMI

0

SLS-RJ45-7.0

SLS-RJ45-7.0

Belden

STRAIN RELIEF, SNAGLESS OVER

0

SLS-RGB-YELLOW

SLS-RGB-YELLOW

Belden

STRAIN RELIEF SLEEVE FOR

0

62363-001

62363-001

Storage & Server IO (Amphenol ICC)

CF CARD KIT SEMI

0

SLS-59/6

SLS-59/6

Belden

STRAIN RELIEF SLEEVE

0

10042618-002

10042618-002

Storage & Server IO (Amphenol ICC)

CONN ACCY CARD RETENTION

0

5146078-1

5146078-1

TE Connectivity AMP Connectors

MEMCD RSD STKD LFT RAIL W/HDWN

0

NX1-32T-KT3K(05)

NX1-32T-KT3K(05)

Hirose

CONN FRAME KIT 32POS 0.3MM 5V

0

AX101719

AX101719

Belden

GIGABIX TERMINATION BAR,

5800

Memory Connectors - Accessories

1. Overview

Memory connectors and accessories are critical components that enable electrical and mechanical connections between memory modules (e.g., RAM, SSDs) and host systems. They ensure reliable signal transmission, power delivery, and mechanical stability in electronic devices. With advancements in computing performance and miniaturization trends, these components have become essential in applications ranging from consumer electronics to industrial systems.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
DIMM Connectors64-bit data path, ZIF (Zero Insertion Force) designDesktop PCs, Servers
SO-DIMM ConnectorsSmaller form factor, 200/260-pin configurationsLaptops, Embedded Systems
U-DIMM ConnectorsUnbuffered memory support, low-latency performanceGaming PCs, Workstations
SIMM Connectors32-bit data path, legacy technologyOlder Servers, Industrial Equipment
RIMM ConnectorsRDRAM-compatible, high-speed signalingLegacy High-Performance Computing

3. Structure & Components

Typical memory connectors consist of:

  • Contact pins (phosphor bronze with gold plating for conductivity)
  • Insulating housing (LCP/LPA material for thermal stability)
  • Actuator mechanism (for ZIF connectors)
  • EMI shielding (for high-frequency applications)
  • Retention clips (mechanical stabilization)

4. Key Technical Specifications

ParameterValue/RangeImportance
Contact Resistance5-20 m Affects signal integrity
Current Rating1-3 A/pinDetermines power capacity
Dielectric Withstanding Voltage500 VACSafety and reliability
Operating Temperature-55 C to +125 CEnvironmental durability
Insertion Force20-50NAffects lifespan
Signal IntegritySupports up to 8 GT/sEnables high-speed memory

5. Application Fields

  • Computer Hardware: Motherboards, Graphics Cards
  • Data Centers: Servers, Storage Arrays
  • Consumer Electronics: Smartphones, Tablets
  • Industrial Equipment: Automation Controllers
  • Telecommunications: Routers, Base Stations

6. Leading Manufacturers & Products

ManufacturerRepresentative Products
TE ConnectivityDDR4 DIMM Connectors, SATA Power Connectors
Amphenol ICCHigh-Speed SO-DIMM Sockets
MolexDDR5 U-DIMM Connectors
SamtecHigh-Frequency Memory Arrays
JAE ElectronicsCompact R-DIMM Solutions

7. Selection Guidelines

Key factors to consider:

  • Compatibility with memory standard (DDR3/DDR4/DDR5)
  • Environmental requirements (temperature, vibration)
  • Electrical performance requirements
  • Space constraints (form factor limitations)
  • Cost vs. reliability trade-offs
  • Compliance with industry standards (JEDEC, IPC)

8. Industry Trends Analysis

Current development trends include:

  • Transition to DDR5/LPDDR5X standards with 8 GT/s+ data rates
  • Miniaturization for mobile and IoT applications
  • Integrated power delivery (Power & Signal in single connector)
  • Advanced thermal management solutions
  • Increased use of press-fit terminations
  • Development of optical memory interconnects

Application Case: In high-density servers, TE Connectivity's DDR4 connectors enable 3200 MT/s memory speeds while maintaining signal integrity below 12 m resistance. For automotive applications, Amphenol's ruggedized SO-DIMM connectors meet AEC-Q100 reliability standards.

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