Memory Connectors - Accessories

Image Part Number Description / PDF Quantity Rfq
558877-1

558877-1

TE Connectivity AMP Connectors

CONNECTOR FRAME SERIES 3

0

5535664-2

5535664-2

TE Connectivity AMP Connectors

MEMCD GUIDE RL STD RGHT W/HDWN

0

C702 N13 031 E2

C702 N13 031 E2

Tuchel / Amphenol

METAL BEZEL BLACK

0

10030581-100LF

10030581-100LF

Storage & Server IO (Amphenol ICC)

CONN EXPRESSCARD/54 MODULE TOP

0

132001-0802

132001-0802

VEAM

COVER TOP 2MM CFAST

0

10030574-2100LF

10030574-2100LF

Storage & Server IO (Amphenol ICC)

CONN EXPRESSCARD/34 MODULE BOTTM

0

0912360002

0912360002

Woodhead - Molex

SIM CARD HLD LGT 28.30MM

0

589181000000018

589181000000018

Elco (AVX)

KIT COMPACT FLASH 50 POS

0

10030582-2100LF

10030582-2100LF

Storage & Server IO (Amphenol ICC)

CONN EXPRESSCARD/54 MODULE BOTTM

0

PX10FS02PH

PX10FS02PH

JAE Electronics

CONN PCMCIA CAGE ASSY STD MNT

0

10030573-100LF

10030573-100LF

Storage & Server IO (Amphenol ICC)

CONN EXPRESSCARD/34 MODULE TOP

0

10030573-200LF

10030573-200LF

Storage & Server IO (Amphenol ICC)

CONN EXPRESSCARD/34 MODULE TOP

0

5535661-2

5535661-2

TE Connectivity AMP Connectors

CONN GUIDE RAIL 68POS RIGHT

0

0787901001

0787901001

Woodhead - Molex

NANO SIM FRAME POP OUT 13MMHT

0

5535661-1

5535661-1

TE Connectivity AMP Connectors

CONN GUIDE RAIL 68POS LEFT

0

132001-0801

132001-0801

VEAM

COVER BOTTOM 2MM CFAST

0

NX-32T-BS

NX-32T-BS

Hirose

CONN BUSHING 32POS

0

10030581-200LF

10030581-200LF

Storage & Server IO (Amphenol ICC)

CONN EXPRESSCARD/54 MODULE TOP

0

5146035-1

5146035-1

TE Connectivity AMP Connectors

MEMCD STKD LFT GUIDE RL W/HDWN

0

NX1BL-32T-KT3B

NX1BL-32T-KT3B

Hirose

CONN CARD BUS FRAME 32POS 0.3MM

0

Memory Connectors - Accessories

1. Overview

Memory connectors and accessories are critical components that enable electrical and mechanical connections between memory modules (e.g., RAM, SSDs) and host systems. They ensure reliable signal transmission, power delivery, and mechanical stability in electronic devices. With advancements in computing performance and miniaturization trends, these components have become essential in applications ranging from consumer electronics to industrial systems.

2. Major Types & Functional Classification

TypeFunctional FeaturesApplication Examples
DIMM Connectors64-bit data path, ZIF (Zero Insertion Force) designDesktop PCs, Servers
SO-DIMM ConnectorsSmaller form factor, 200/260-pin configurationsLaptops, Embedded Systems
U-DIMM ConnectorsUnbuffered memory support, low-latency performanceGaming PCs, Workstations
SIMM Connectors32-bit data path, legacy technologyOlder Servers, Industrial Equipment
RIMM ConnectorsRDRAM-compatible, high-speed signalingLegacy High-Performance Computing

3. Structure & Components

Typical memory connectors consist of:

  • Contact pins (phosphor bronze with gold plating for conductivity)
  • Insulating housing (LCP/LPA material for thermal stability)
  • Actuator mechanism (for ZIF connectors)
  • EMI shielding (for high-frequency applications)
  • Retention clips (mechanical stabilization)

4. Key Technical Specifications

ParameterValue/RangeImportance
Contact Resistance5-20 m Affects signal integrity
Current Rating1-3 A/pinDetermines power capacity
Dielectric Withstanding Voltage500 VACSafety and reliability
Operating Temperature-55 C to +125 CEnvironmental durability
Insertion Force20-50NAffects lifespan
Signal IntegritySupports up to 8 GT/sEnables high-speed memory

5. Application Fields

  • Computer Hardware: Motherboards, Graphics Cards
  • Data Centers: Servers, Storage Arrays
  • Consumer Electronics: Smartphones, Tablets
  • Industrial Equipment: Automation Controllers
  • Telecommunications: Routers, Base Stations

6. Leading Manufacturers & Products

ManufacturerRepresentative Products
TE ConnectivityDDR4 DIMM Connectors, SATA Power Connectors
Amphenol ICCHigh-Speed SO-DIMM Sockets
MolexDDR5 U-DIMM Connectors
SamtecHigh-Frequency Memory Arrays
JAE ElectronicsCompact R-DIMM Solutions

7. Selection Guidelines

Key factors to consider:

  • Compatibility with memory standard (DDR3/DDR4/DDR5)
  • Environmental requirements (temperature, vibration)
  • Electrical performance requirements
  • Space constraints (form factor limitations)
  • Cost vs. reliability trade-offs
  • Compliance with industry standards (JEDEC, IPC)

8. Industry Trends Analysis

Current development trends include:

  • Transition to DDR5/LPDDR5X standards with 8 GT/s+ data rates
  • Miniaturization for mobile and IoT applications
  • Integrated power delivery (Power & Signal in single connector)
  • Advanced thermal management solutions
  • Increased use of press-fit terminations
  • Development of optical memory interconnects

Application Case: In high-density servers, TE Connectivity's DDR4 connectors enable 3200 MT/s memory speeds while maintaining signal integrity below 12 m resistance. For automotive applications, Amphenol's ruggedized SO-DIMM connectors meet AEC-Q100 reliability standards.

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