Keystone - Inserts

Image Part Number Description / PDF Quantity Rfq
AX103158

AX103158

Belden

KEYSTONE LC KEYED MODULE

0

AX105698-WH

AX105698-WH

Belden

MDVO SC APC MODULE, WHITE

0

AX105641-AL

AX105641-AL

Belden

KCONN LC DUP MM ER-VI, ALM

0

AX105352-EW

AX105352-EW

Belden

KCONN SIDE ENTRY BOX 1P E-WH

1669

AX105346-BK

AX105346-BK

Belden

KCONN F-COAX 3GHZ, BLK

0

AX102270

AX102270

Belden

10GX JACK MDVO ALMOND

0

A0407009

A0407009

Belden

MDVO ST FIBER MODULE,

70

AX102580

AX102580

Belden

MEDIAFLEX SVGA IDC INSER

0

AX105384

AX105384

Belden

KCONN F-COAX MODULE D-GY

0

AX105341-BK

AX105341-BK

Belden

KCONN RCA-BL COUPLER, BLK

0

AX101043

AX101043

Belden

FLEX MODULE, USOC, BROWN

0

AX101048

AX101048

Belden

CAT5E JACK MDVO ORANGE TIA606

2346

AX103032

AX103032

Belden

MDVO LC KEY DUP MM SL-BK

0

AX105643-EW

AX105643-EW

Belden

KCONN SC SIMP MODULE, EW

0

AX105338-AL

AX105338-AL

Belden

KCONN RCA-WH COUPLER, ALM

0

AX101942

AX101942

Belden

MEDIAFLEX SC MM DUPLEX 3

0

AX102041

AX102041

Belden

DECORA INSERT 1P HORZ BL

0

AX102215

AX102215

Belden

MDVO LC DUP SM MOD WHITE

0

A0407006

A0407006

Belden

MDVO SC FIBER MODULE,

120

AX105643-BK

AX105643-BK

Belden

KCONN SC SIMP MODULE, BK

60

Keystone - Inserts

1. Overview

Keystone inserts are modular interface components designed to facilitate secure and reliable signal or power transmission in structured cabling systems. As standardized interconnect solutions, they serve as fundamental building blocks in telecommunications, networking, and audio/video infrastructure. Their interchangeable design enables rapid deployment and scalability in environments requiring high-density connectivity solutions.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ45 Ethernet8P8C configuration, supports 10/100/1000BASE-T networksNetwork switches, PoE devices
RJ11/126P4C/6P6C configurations, voice/data transmissionTelephony systems, fax machines
Fiber OpticLC/SC/MPO interfaces, single/multi-mode supportData centers, backbone networks
Coaxial75 /50 impedance, RF signal transmissionCCTV systems, satellite receivers
CompositeMulti-protocol integration (HDMI/USB/Power over Ethernet)AV distribution systems

3. Structural Composition

Standard keystone inserts feature a three-part architecture: - Dielectric housing: High-temperature thermoplastic (LCP/PBT) with integrated strain relief - Contact array: Phosphor bronze conductors with 50 " gold plating (25 " minimum standard) - Latching mechanism: Molded polymer actuator with >20N retention force Optional EMI shielding employs 0.1mm thick phosphor bronze cans with 360 coverage.

4. Key Technical Specifications

ParameterValue RangeImportance
Insertion Loss 0.5dB @100MHzSignal integrity maintenance
Contact Resistance10-30m (initial)Power transmission efficiency
Withstand Voltage1000VAC rmsElectrical safety compliance
Mating Cycles750-1500 cyclesService life prediction
Operating Temperature-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecommunications: Central office switching systems, DSLAM cabinets
  • Data Centers: 1U patch panels, high-density fiber distribution
  • Security Systems: IP camera connectivity, access control panels
  • Industrial Automation: PROFINET/Industrial Ethernet nodes
  • Residential: Smart home gateway integration

6. Leading Manufacturers and Products

ManufacturerProduct LineKey Features
TE ConnectivityDEUTSCH DT SeriesIP68-rated, automotive-grade durability
AmphenolOptiCore OCX100Gbps fiber optic transmission
MolexGigabit EthernetShielded Cat6A compliance
Bel StewartPower over Ethernet100W (IEEE 802.3bt) support
PanduitNetKey HDX28% smaller footprint than standard

7. Selection Guidelines

Key selection criteria include: - Signal type and bandwidth requirements (e.g., 25Gbps vs 100Gbps optics) - Environmental factors (temperature, vibration, EMI exposure) - Termination method compatibility (IDC/P CB/Welding) - Regulatory compliance (UL 94V-0, RoHS, REACH) - Cost/performance balance (gold thickness vs cycle life) Actual case: Selecting shielded fiber optic keystone inserts with MPO interfaces for 40Gbps backbone deployment in a Tier III data center.

8. Industry Trends

Current development trends include: - Miniaturization (SFP-DD/OSFP form factors) - Integrated PoE management (smart power negotiation) - Enhanced thermal performance (graphene-enhanced polymers) - Optical engine integration (on-board transceivers) - Sustainability focus (bio-based plastics, 100% recyclable metals)

RFQ BOM Call Skype Email
Top