Keystone - Inserts

Image Part Number Description / PDF Quantity Rfq
AX102094

AX102094

Belden

MDVO LC KEY DUP MM BL-GY

0

AX102040

AX102040

Belden

DECORA INSERT 1P HORZ WH

0

AX105342-EW

AX105342-EW

Belden

KCONN USB3 A-A F/F COUPER, EW

0

AX101841

AX101841

Belden

S-VHS MDVO INSERT,

0

AX102337

AX102337

Belden

MEDIAFLEX SVGA FEED THRO

0

AX102242

AX102242

Belden

KCONN ST MODULE MM/SM ALM

0

AX101042

AX101042

Belden

FLEX MODULE, USOC, PURPLE

0

HIP-S3V

HIP-S3V

Belden

SPLITTER 3 WAY SAT

0

AX104157

AX104157

Belden

10GX JACK KCONN PURPLE (DARK)

162

AX102103

AX102103

Belden

MDVO LC KEY DUP MM YL-WH

0

AX101038

AX101038

Belden

FLEX MODULE, USOC, RED

0

AX101313

AX101313

Belden

CAT5E JACK KCONN YELLOW TIA606

440

AX101770

AX101770

Belden

MEDIAFLEX UTP INSERT 2-P

0

AX105505-YE

AX105505-YE

Belden

MDVO LC DUP LOMM MOD, YEL

0

AX102104

AX102104

Belden

MDVO LC KEY DUP MM BK-WH

0

AX105339-BK

AX105339-BK

Belden

KCONN RCA-YE COUPLER, BLK

0

AX102289

AX102289

Belden

10GX JACK KCONN PURPLE TIA606

0

AX101307

AX101307

Belden

CAT5E JACK KCONN GRAY

0

AX102639

AX102639

Belden

MEDIAFLEX DB9 FEED THROU

0

AX105697-GY

AX105697-GY

Belden

MDVO SC OM3 MODULE GRAY

0

Keystone - Inserts

1. Overview

Keystone inserts are modular interface components designed to facilitate secure and reliable signal or power transmission in structured cabling systems. As standardized interconnect solutions, they serve as fundamental building blocks in telecommunications, networking, and audio/video infrastructure. Their interchangeable design enables rapid deployment and scalability in environments requiring high-density connectivity solutions.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ45 Ethernet8P8C configuration, supports 10/100/1000BASE-T networksNetwork switches, PoE devices
RJ11/126P4C/6P6C configurations, voice/data transmissionTelephony systems, fax machines
Fiber OpticLC/SC/MPO interfaces, single/multi-mode supportData centers, backbone networks
Coaxial75 /50 impedance, RF signal transmissionCCTV systems, satellite receivers
CompositeMulti-protocol integration (HDMI/USB/Power over Ethernet)AV distribution systems

3. Structural Composition

Standard keystone inserts feature a three-part architecture: - Dielectric housing: High-temperature thermoplastic (LCP/PBT) with integrated strain relief - Contact array: Phosphor bronze conductors with 50 " gold plating (25 " minimum standard) - Latching mechanism: Molded polymer actuator with >20N retention force Optional EMI shielding employs 0.1mm thick phosphor bronze cans with 360 coverage.

4. Key Technical Specifications

ParameterValue RangeImportance
Insertion Loss 0.5dB @100MHzSignal integrity maintenance
Contact Resistance10-30m (initial)Power transmission efficiency
Withstand Voltage1000VAC rmsElectrical safety compliance
Mating Cycles750-1500 cyclesService life prediction
Operating Temperature-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecommunications: Central office switching systems, DSLAM cabinets
  • Data Centers: 1U patch panels, high-density fiber distribution
  • Security Systems: IP camera connectivity, access control panels
  • Industrial Automation: PROFINET/Industrial Ethernet nodes
  • Residential: Smart home gateway integration

6. Leading Manufacturers and Products

ManufacturerProduct LineKey Features
TE ConnectivityDEUTSCH DT SeriesIP68-rated, automotive-grade durability
AmphenolOptiCore OCX100Gbps fiber optic transmission
MolexGigabit EthernetShielded Cat6A compliance
Bel StewartPower over Ethernet100W (IEEE 802.3bt) support
PanduitNetKey HDX28% smaller footprint than standard

7. Selection Guidelines

Key selection criteria include: - Signal type and bandwidth requirements (e.g., 25Gbps vs 100Gbps optics) - Environmental factors (temperature, vibration, EMI exposure) - Termination method compatibility (IDC/P CB/Welding) - Regulatory compliance (UL 94V-0, RoHS, REACH) - Cost/performance balance (gold thickness vs cycle life) Actual case: Selecting shielded fiber optic keystone inserts with MPO interfaces for 40Gbps backbone deployment in a Tier III data center.

8. Industry Trends

Current development trends include: - Miniaturization (SFP-DD/OSFP form factors) - Integrated PoE management (smart power negotiation) - Enhanced thermal performance (graphene-enhanced polymers) - Optical engine integration (on-board transceivers) - Sustainability focus (bio-based plastics, 100% recyclable metals)

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