Keystone - Inserts

Image Part Number Description / PDF Quantity Rfq
AX101825

AX101825

Belden

RCA MDVO INSERT WHITE, W

9

AX101833

AX101833

Belden

RCA MDVO INSERT WHITE, R

0

AX100174

AX100174

Belden

EZ-MDVO UTP MODULE,

0

AX104194-B24

AX104194-B24

Belden

CAT6+ JACK KCONN PURPLE

0

AX102685

AX102685

Belden

KCONN SC SIMP MM MODULE, BLK

0

AX101831

AX101831

Belden

RCA MDVO INSERT GRAY RED

0

AX105335-EW

AX105335-EW

Belden

KCONN AUDIO 3.5MM F/SOLDER, EW

0

AX105336-BK

AX105336-BK

Belden

KCONN S-VIDEO F/F COUPER, BK

0

AX102110

AX102110

Belden

MDVO LC KEY DUP MM BK-BK

0

AX105344-AL

AX105344-AL

Belden

KCONN USB2 B-B F/F COUPER, AL

0

AX105505-AL

AX105505-AL

Belden

MDVO LC DUP LOMM MOD, ALM

0

AX105374-AL

AX105374-AL

Belden

KCONN SC APC SIMP MODULE, AL

0

AX104624-01

AX104624-01

Belden

MDVO SC SM MODULE GRAY

0

AX104624-04

AX104624-04

Belden

MDVO SC SM MODULE, BLACK

0

AX103154

AX103154

Belden

KEYSTONE LC KEYED MODULE

0

AX102650

AX102650

Belden

MEDIAFLEX SC MM DUPLEX 3

0

AX105697-AL

AX105697-AL

Belden

MDVO SC OM3 MODULE, ALMOND

0

A0644656

A0644656

Belden

BIX DVO OUTLET, SURFACE,

0

AX105345-BK

AX105345-BK

Belden

KCONN HDMI COUPLER, BLACK

144

AX102271

AX102271

Belden

10GX JACK MDVO WHITE

0

Keystone - Inserts

1. Overview

Keystone inserts are modular interface components designed to facilitate secure and reliable signal or power transmission in structured cabling systems. As standardized interconnect solutions, they serve as fundamental building blocks in telecommunications, networking, and audio/video infrastructure. Their interchangeable design enables rapid deployment and scalability in environments requiring high-density connectivity solutions.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
RJ45 Ethernet8P8C configuration, supports 10/100/1000BASE-T networksNetwork switches, PoE devices
RJ11/126P4C/6P6C configurations, voice/data transmissionTelephony systems, fax machines
Fiber OpticLC/SC/MPO interfaces, single/multi-mode supportData centers, backbone networks
Coaxial75 /50 impedance, RF signal transmissionCCTV systems, satellite receivers
CompositeMulti-protocol integration (HDMI/USB/Power over Ethernet)AV distribution systems

3. Structural Composition

Standard keystone inserts feature a three-part architecture: - Dielectric housing: High-temperature thermoplastic (LCP/PBT) with integrated strain relief - Contact array: Phosphor bronze conductors with 50 " gold plating (25 " minimum standard) - Latching mechanism: Molded polymer actuator with >20N retention force Optional EMI shielding employs 0.1mm thick phosphor bronze cans with 360 coverage.

4. Key Technical Specifications

ParameterValue RangeImportance
Insertion Loss 0.5dB @100MHzSignal integrity maintenance
Contact Resistance10-30m (initial)Power transmission efficiency
Withstand Voltage1000VAC rmsElectrical safety compliance
Mating Cycles750-1500 cyclesService life prediction
Operating Temperature-40 C to +85 CEnvironmental adaptability

5. Application Fields

  • Telecommunications: Central office switching systems, DSLAM cabinets
  • Data Centers: 1U patch panels, high-density fiber distribution
  • Security Systems: IP camera connectivity, access control panels
  • Industrial Automation: PROFINET/Industrial Ethernet nodes
  • Residential: Smart home gateway integration

6. Leading Manufacturers and Products

ManufacturerProduct LineKey Features
TE ConnectivityDEUTSCH DT SeriesIP68-rated, automotive-grade durability
AmphenolOptiCore OCX100Gbps fiber optic transmission
MolexGigabit EthernetShielded Cat6A compliance
Bel StewartPower over Ethernet100W (IEEE 802.3bt) support
PanduitNetKey HDX28% smaller footprint than standard

7. Selection Guidelines

Key selection criteria include: - Signal type and bandwidth requirements (e.g., 25Gbps vs 100Gbps optics) - Environmental factors (temperature, vibration, EMI exposure) - Termination method compatibility (IDC/P CB/Welding) - Regulatory compliance (UL 94V-0, RoHS, REACH) - Cost/performance balance (gold thickness vs cycle life) Actual case: Selecting shielded fiber optic keystone inserts with MPO interfaces for 40Gbps backbone deployment in a Tier III data center.

8. Industry Trends

Current development trends include: - Miniaturization (SFP-DD/OSFP form factors) - Integrated PoE management (smart power negotiation) - Enhanced thermal performance (graphene-enhanced polymers) - Optical engine integration (on-board transceivers) - Sustainability focus (bio-based plastics, 100% recyclable metals)

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