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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
0522710879

0522710879

Woodhead - Molex

CONN FPC BOTTOM 8POS 1.00MM R/A

2741
0541043031

0541043031

Woodhead - Molex

CONN FFC TOP 30POS 0.50MM R/A

1245645000
5020783310

5020783310

Woodhead - Molex

CONN FPC BOTTOM 33POS 0.25MM R/A

0
0522070833

0522070833

Woodhead - Molex

CONN FFC FPC TOP 8POS 1.00MM R/A

9972
5035663500

5035663500

Woodhead - Molex

CONN FPC BOTTOM 35POS 0.30MM R/A

5320
5051101092

5051101092

Woodhead - Molex

CONN FPC BOTTOM 10POS .5MM R/A

0
0541043531

0541043531

Woodhead - Molex

CONN FFC TOP 35POS 0.50MM R/A

8451
0526100733

0526100733

Woodhead - Molex

CONN FPC VERT 7POS 1.00MM SMD

2950
0524352671

0524352671

Woodhead - Molex

CONN FFC TOP 26POS 0.50MM R/A

3804
5051102091

5051102091

Woodhead - Molex

CONN FFC/FPC BOTTOM 20P .5MM R/A

26222
5051100492

5051100492

Woodhead - Molex

CONN FPC BOTTOM 4POS .5MM R/A

23947
0524352633

0524352633

Woodhead - Molex

CONN FFC TOP 26POS 0.50MM R/A

2498
0522070360

0522070360

Woodhead - Molex

CONN FFC FPC TOP 3POS 1.00MM R/A

13328
0528520472

0528520472

Woodhead - Molex

CONN FFC BOTTOM 4POS 1.00MM R/A

4410
5051100592

5051100592

Woodhead - Molex

CONN FPC BOTTOM 5POS .5MM R/A

3067
5033203760

5033203760

Woodhead - Molex

CONN FPC BOTTOM 37POS 0.25MM R/A

0
0526101434

0526101434

Woodhead - Molex

CONN FPC VERT 14POS 1.00MM SMD

0
0528081571

0528081571

Woodhead - Molex

CONN FFC FPC VERT 15POS 1MM SMD

100
5019514000

5019514000

Woodhead - Molex

CONN FFC VERT 40POS 0.50MM SMD

146
5051101792

5051101792

Woodhead - Molex

CONN FPC BOTTOM 17POS .5MM R/A

17690

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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