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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
0522071660

0522071660

Woodhead - Molex

CONN FFC FPC TOP 16POS 1MM R/A

4218
2004850440

2004850440

Woodhead - Molex

0.5ONE-TOUCH RA 40P

1500
0545500671

0545500671

Woodhead - Molex

CONN FFC FPC TOP 6POS 0.50MM R/A

1094
5034801700

5034801700

Woodhead - Molex

CONN FFC FPC 17POS 0.50MM R/A

16985
0525591033

0525591033

Woodhead - Molex

CONN FFC VERT 10POS 0.50MM SMD

5025
0541325062

0541325062

Woodhead - Molex

CONN FFC BOTTOM 50POS 0.50MM R/A

6544
0526101272

0526101272

Woodhead - Molex

CONN FPC VERT 12POS 1.00MM SMD

74892000
5022501791

5022501791

Woodhead - Molex

CONN FPC 17POS 0.30MM R/A

11948
0781271328

0781271328

Woodhead - Molex

CONN FFC VERT 32POS 0.50MM SMD

1425
0543934581

0543934581

Woodhead - Molex

CONN FPC BOTTOM 45POS 0.30MM R/A

273
0015388060

0015388060

Woodhead - Molex

CONN CIC FFC RCPT 6POS 2.54MM

1570
5019516000

5019516000

Woodhead - Molex

CONN FFC VERT 60POS 0.50MM SMD

1390
0527461471

0527461471

Woodhead - Molex

CONN FFC BOTTOM 14POS 0.50MM R/A

1887
0525593633

0525593633

Woodhead - Molex

CONN FFC VERT 36POS 0.50MM SMD

1767
0039532125

0039532125

Woodhead - Molex

CONN FFC VERT 12POS 1.25MM PCB

9034
5022442430

5022442430

Woodhead - Molex

CONN FFC BOTTOM 24POS 0.50MM R/A

0
0781271210

0781271210

Woodhead - Molex

0.5 FPC CONN. ZIF ST EMB TP PKG

6701
0541043231

0541043231

Woodhead - Molex

CONN FFC TOP 32POS 0.50MM R/A

4071
5022504191

5022504191

Woodhead - Molex

CONN FPC 41POS 0.30MM R/A

3550
0527450433

0527450433

Woodhead - Molex

CONN FFC FPC TOP 4POS 0.50MM R/A

3128

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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