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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
0541323233

0541323233

Woodhead - Molex

CONN FFC BOTTOM 32POS 0.50MM R/A

2332
5019513000

5019513000

Woodhead - Molex

CONN FFC VERT 30POS 0.50MM SMD

6249
0781193610

0781193610

Woodhead - Molex

CONN 0.5 FPC ZIF ST TP 36CKT

0
0526100533

0526100533

Woodhead - Molex

CONN FPC VERT 5POS 1.00MM SMD

4365
0527461833

0527461833

Woodhead - Molex

CONN FFC BOTTOM 18POS 0.50MM R/A

1097
2005280110

2005280110

Woodhead - Molex

1.0 FPC ZIF BTM CONT EMBT PKG 11

2859
5052781633

5052781633

Woodhead - Molex

0.5 FFC ZIF BTM CONT EMBT PKG 16

36000
0545481071

0545481071

Woodhead - Molex

CONN FFC BOTTOM 10POS 0.50MM R/A

0
0526101033

0526101033

Woodhead - Molex

CONN FPC VERT 10POS 1.00MM SMD

14353
0527451097

0527451097

Woodhead - Molex

CONN FFC TOP 10POS 0.50MM R/A

6048
0522071133

0522071133

Woodhead - Molex

CONN FFC FPC TOP 11POS 1MM R/A

4356
0512964533

0512964533

Woodhead - Molex

CONN FFC BOTTOM 45POS 0.50MM R/A

8660
5035661100

5035661100

Woodhead - Molex

CONN FPC BOTTOM 11POS 0.30MM R/A

53
5051101892

5051101892

Woodhead - Molex

CONN FPC BOTTOM 18POS .5MM R/A

3
5016283991

5016283991

Woodhead - Molex

CONN FPC BOTTOM 39POS 0.30MM R/A

2786
5051470290

5051470290

Woodhead - Molex

CONN FPC BOTTOM 2POS 2MM SMD R/A

0
0522711769

0522711769

Woodhead - Molex

CONN FPC BOTTOM 17POS 1.00MM R/A

1314
0528070310

0528070310

Woodhead - Molex

CONN FPC TOP 3POS 1.00MM R/A

15332
5042811100

5042811100

Woodhead - Molex

CONN FPC 11POS 0.30MM R/A

0
0525591252

0525591252

Woodhead - Molex

CONN FFC VERT 12POS 0.50MM SMD

9220

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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