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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
0541323362

0541323362

Woodhead - Molex

CONN FFC BOTTOM 33POS 0.50MM R/A

3165
0514411693

0514411693

Woodhead - Molex

CONN FFC BOTTOM 16POS 0.50MM R/A

1921
0520452045

0520452045

Woodhead - Molex

CONN FFC VERT 20POS 1.25MM PCB

2896
0524353071

0524353071

Woodhead - Molex

CONN FFC TOP 30POS 0.50MM R/A

3358
0545502271

0545502271

Woodhead - Molex

CONN FFC TOP 22POS 0.50MM R/A

17519
0528082870

0528082870

Woodhead - Molex

CONN FPC VERT 28POS 1.00MM SMD

1740
0527932470

0527932470

Woodhead - Molex

CONN FPC TOP 24POS 1.00MM R/A

1384
0545501071

0545501071

Woodhead - Molex

CONN FFC TOP 10POS 0.50MM R/A

0
0528072210

0528072210

Woodhead - Molex

CONN FPC TOP 22POS 1.00MM R/A

299
5019513210

5019513210

Woodhead - Molex

CONN FFC VERT 32POS 0.50MM SMD

7756
0545480571

0545480571

Woodhead - Molex

CONN FFC BOTTOM 5POS 0.50MM R/A

3163
0527450697

0527450697

Woodhead - Molex

CONN FFC TOP 6POS 0.50MM R/A

1687
0522711479

0522711479

Woodhead - Molex

CONN FPC BOTTOM 14POS 1.00MM R/A

904
5022312400

5022312400

Woodhead - Molex

CONN FFC VERT 24POS 0.50MM SMD

0
0525592534

0525592534

Woodhead - Molex

CONN FFC VERT 25POS 0.50MM SMD

2377
0514411893

0514411893

Woodhead - Molex

CONN FFC BOTTOM 18POS 0.50MM R/A

0
0541044596

0541044596

Woodhead - Molex

CONN FFC TOP 45POS 0.50MM R/A

272
0015388040

0015388040

Woodhead - Molex

CONN CIC FFC RCPT 4POS 2.54MM

2547
0522072533

0522072533

Woodhead - Molex

CONN FFC FPC TOP 25POS 1MM R/A

2712
0527451897

0527451897

Woodhead - Molex

CONN FFC TOP 18POS 0.50MM R/A

4686

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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