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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
0039532164

0039532164

Woodhead - Molex

CONN FFC TOP 16POS 1.25MM R/A

4283
5019123390

5019123390

Woodhead - Molex

CONN FPC BOTTOM 33POS 0.30MM R/A

10430
0528072010

0528072010

Woodhead - Molex

CONN FPC TOP 20POS 1.00MM R/A

3179
0528061610

0528061610

Woodhead - Molex

CONN FPC VERT 16POS 1.00MM PCB

16295
5007972394

5007972394

Woodhead - Molex

CONN FPC BOTTOM 23POS 0.30MM R/A

127
0545480971

0545480971

Woodhead - Molex

CONN FFC BOTTOM 9POS 0.50MM R/A

0
0522072860

0522072860

Woodhead - Molex

CONN FFC FPC TOP 28POS 1MM R/A

1000
0015474123

0015474123

Woodhead - Molex

CONN FFC CIC RCPT 12POS 2.54MM

1018
0528921233

0528921233

Woodhead - Molex

CONN FFC BOTTOM 12POS 0.50MM R/A

10876
0512963494

0512963494

Woodhead - Molex

CONN FFC BOTTOM 34POS 0.50MM R/A

4645
5022443330

5022443330

Woodhead - Molex

CONN FFC BOTTOM 33POS 0.50MM R/A

11660
0522711469

0522711469

Woodhead - Molex

CONN FPC BOTTOM 14POS 1.00MM R/A

1922
0528082770

0528082770

Woodhead - Molex

CONN FPC VERT 27POS 1.00MM SMD

1644
5022441530

5022441530

Woodhead - Molex

CONN FFC BOTTOM 15POS 0.50MM R/A

4752
0039532165

0039532165

Woodhead - Molex

CONN FFC VERT 16POS 1.25MM PCB

181
0528081370

0528081370

Woodhead - Molex

CONN FPC VERT 13POS 1.00MM SMD

3800
0512960833

0512960833

Woodhead - Molex

CONN FFC BOTTOM 8POS 0.50MM R/A

1136
0527451197

0527451197

Woodhead - Molex

CONN FFC TOP 11POS 0.50MM R/A

6640
0528060910

0528060910

Woodhead - Molex

CONN FPC VERT 9POS 1.00MM PCB

6140
0541323033

0541323033

Woodhead - Molex

CONN FFC BOTTOM 30POS 0.50MM R/A

2335

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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