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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
5027906491

5027906491

Woodhead - Molex

CONN FPC BOTTOM 64POS 0.50MM R/A

4334
0522070333

0522070333

Woodhead - Molex

CONN FFC FPC TOP 3POS 1.00MM R/A

476016000
0528080671

0528080671

Woodhead - Molex

CONN FFC FPC VERT 6POS 1MM SMD

1245736000
5019514010

5019514010

Woodhead - Molex

CONN FFC VERT 40POS 0.50MM SMD

1660
0528070910

0528070910

Woodhead - Molex

CONN FPC TOP 9POS 1.00MM R/A

2287
0039532104

0039532104

Woodhead - Molex

CONN FFC TOP 10POS 1.25MM R/A

12168
0039532275

0039532275

Woodhead - Molex

CONN FFC VERT 27POS 1.25MM PCB

535
0528933095

0528933095

Woodhead - Molex

CONN FFC BOTTOM 30POS 0.50MM R/A

64
0528081871

0528081871

Woodhead - Molex

CONN FFC FPC VERT 18POS 1MM SMD

2706
0525592033

0525592033

Woodhead - Molex

CONN FFC VERT 20POS 0.50MM SMD

0
2004850710

2004850710

Woodhead - Molex

0.5ONE-TOUCH ST 10P

1200
0527451033

0527451033

Woodhead - Molex

CONN FFC TOP 10POS 0.50MM R/A

831118000
0522071160

0522071160

Woodhead - Molex

CONN FFC FPC TOP 11POS 1MM R/A

1432
0039532285

0039532285

Woodhead - Molex

CONN FFC VERT 28POS 1.25MM PCB

593
0541043331

0541043331

Woodhead - Molex

CONN FFC TOP 33POS 0.50MM R/A

3183
2004850540

2004850540

Woodhead - Molex

0.5ONE-TOUCH ST 40P

1195
0545481233

0545481233

Woodhead - Molex

CONN FFC BOTTOM 12POS 0.5MM R/A

14313
0524372771

0524372771

Woodhead - Molex

CONN FFC BOTTOM 27POS 0.50MM R/A

14
0528081270

0528081270

Woodhead - Molex

CONN FPC VERT 12POS 1.00MM SMD

0
0526103033

0526103033

Woodhead - Molex

CONN FPC VERT 30POS 1.00MM SMD

3569

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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