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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
0525592253

0525592253

Woodhead - Molex

CONN FFC VERT 22POS 0.50MM SMD

4369
5040703991

5040703991

Woodhead - Molex

CONN FPC 39POS 0.20MM R/A

1133
0520452645

0520452645

Woodhead - Molex

CONN FFC VERT 26POS 1.25MM PCB

0
0022023083

0022023083

Woodhead - Molex

CONN FFC VERT 8POS 2.54MM PCB

0
0527932270

0527932270

Woodhead - Molex

CONN FPC TOP 22POS 1.00MM R/A

3992
0520440445

0520440445

Woodhead - Molex

CONN FFC FPC TOP 4POS 1.25MM R/A

1052
0527451433

0527451433

Woodhead - Molex

CONN FFC TOP 14POS 0.50MM R/A

5591
0528083070

0528083070

Woodhead - Molex

CONN FPC VERT 30POS 1.00MM SMD

3840
0528520570

0528520570

Woodhead - Molex

CONN FFC BOTTOM 5POS 1.00MM R/A

264
5019514510

5019514510

Woodhead - Molex

CONN FFC VERT 45POS 0.50MM SMD

589
0527461371

0527461371

Woodhead - Molex

CONN FFC BOTTOM 13POS 0.50MM R/A

0
0526102633

0526102633

Woodhead - Molex

CONN FPC VERT 26POS 1.00MM SMD

0
0522070960

0522070960

Woodhead - Molex

CONN FFC FPC TOP 9POS 1.00MM R/A

1454
0526100972

0526100972

Woodhead - Molex

CONN FPC VERT 9POS 1.00MM SMD

5335
0526101472

0526101472

Woodhead - Molex

CONN FPC VERT 14POS 1.00MM SMD

510
5051102691

5051102691

Woodhead - Molex

CONN FFC/FPC BOTTOM 26P .5MM R/A

6538
0525591834

0525591834

Woodhead - Molex

CONN FFC VERT 18POS 0.50MM SMD

412
0525592752

0525592752

Woodhead - Molex

CONN FFC VERT 27POS 0.50MM SMD

198
0541323333

0541323333

Woodhead - Molex

CONN FFC BOTTOM 33POS 0.50MM R/A

739
5019512010

5019512010

Woodhead - Molex

CONN FFC VERT 20POS 0.50MM SMD

17412

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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