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FFC, FPC (Flat Flexible) Connectors

Image Part Number Description / PDF Quantity Rfq
0528521270

0528521270

Woodhead - Molex

CONN FFC BOTTOM 12POS 1.00MM R/A

10286
0524372871

0524372871

Woodhead - Molex

CONN FFC BOTTOM 28POS 0.50MM R/A

0
0520451545

0520451545

Woodhead - Molex

CONN FFC VERT 15POS 1.25MM PCB

623
5051101392

5051101392

Woodhead - Molex

CONN FPC BOTTOM 13POS .5MM R/A

2978
0528521670

0528521670

Woodhead - Molex

CONN FFC BOTTOM 16POS 1.00MM R/A

7204
2004850535

2004850535

Woodhead - Molex

0.5 ONE-TOUCH ST 35P

9600
2005280070

2005280070

Woodhead - Molex

1.0 FPC ZIF BTM CONT EMBT PKG 7C

9183
0528080870

0528080870

Woodhead - Molex

CONN FPC VERT 8POS 1.00MM SMD

653
0522070433

0522070433

Woodhead - Molex

CONN FFC FPC TOP 4POS 1.00MM R/A

403
0039532124

0039532124

Woodhead - Molex

CONN FFC TOP 12POS 1.25MM R/A

3511
0522072660

0522072660

Woodhead - Molex

CONN FFC FPC TOP 26POS 1MM R/A

848
5034803200

5034803200

Woodhead - Molex

CONN FFC FPC 32POS 0.50MM R/A

11231
0528922833

0528922833

Woodhead - Molex

CONN FFC BOTTOM 28POS 0.50MM R/A

961
0522711579

0522711579

Woodhead - Molex

CONN FPC BOTTOM 15POS 1.00MM R/A

2010
5016164185

5016164185

Woodhead - Molex

CONN FPC TOP 41POS 0.30MM R/A

0
0528520770

0528520770

Woodhead - Molex

CONN FFC BOTTOM 7POS 1.00MM R/A

11164
5019512410

5019512410

Woodhead - Molex

CONN FFC VERT 24POS 0.50MM SMD

7932
0545501671

0545501671

Woodhead - Molex

CONN FFC TOP 16POS 0.50MM R/A

0
0528070610

0528070610

Woodhead - Molex

CONN FPC TOP 6POS 1.00MM R/A

3384
0528082371

0528082371

Woodhead - Molex

CONN FFC FPC VERT 23POS 1MM SMD

0

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

TypeFunctional FeaturesApplication Examples
ZIF (Zero Insertion Force)Self-aligning contacts with minimal mating forceSmartphone displays, medical imaging devices
LIF (Low Insertion Force)Economical solution with moderate insertion forceConsumer electronics, industrial sensors
Wrap-style FPC360 bending capability with exposed contactsAutomotive infotainment systems
Stiffener-reinforced FFCLocalized rigidity for component mountingAerospace control panels

3. Structure & Composition

Typical construction includes:

  • Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
  • Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
  • Contact Interface: Phosphor bronze or beryllium copper terminals
  • Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

ParameterImportanceTypical Range
Contact ResistanceSignal integrity maintenance10-50m
Current RatingPower transmission capability0.5-3A per pin
Operating TemperatureEnvironmental reliability-40 C to +105 C
Flex LifeDurability in dynamic applications10,000-200,000 cycles
Pitch SizeMiniaturization factor0.3mm-1.27mm

5. Application Fields

  • Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
  • Automotive: Dashboard clusters, ADAS sensors, infotainment systems
  • Medical: Portable monitors, imaging equipment (MRI connectors)
  • Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

ManufacturerRepresentative ProductsKey Features
TE ConnectivityMicro Speed FFC0.5mm pitch, 30G durability
MolexPicoBlade FPCSpace-saving LIF design
JAE ElectronicsDF12 SeriesHigh-speed transmission up to 10Gbps
Hirose ElectricFH34 SeriesSelf-mating connector system

7. Selection Guidelines

Key considerations:

  • Circuit density requirements (pitch size vs. pin count)
  • Mechanical stress analysis (bend radius, flex cycles)
  • Thermal management needs (current load vs. conductor thickness)
  • Environmental sealing requirements (IP rating)
  • Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

  • Sub-0.3mm pitch connectors for 5G mobile devices
  • Integrated EMI shielding in FPC structures
  • High-temperature resistant materials (up to 150 C)
  • 3D-shaped FPCs for automotive LiDAR systems
  • Smart connectors with embedded sensing capabilities
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