FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
5051103591 Woodhead - Molex	CONN FFC/FPC BOTTOM 35P .5MM R/A	2728
20FMN-BMTTR-A-TB(LF)(SN) JST	CONN FFC VERT 20POS 1.00MM SMD	0
HLW24S-2C7LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 24POS 1MM PCB	6733
SFW15S-2STE1LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 15POS 1MM SMD	820
FH12-32S-0.5SH(1)(98) Hirose	CONN FFC BOTTOM 32POS 0.50MM R/A	0
1735042-5 TE Connectivity AMP Connectors	CONN FFC FPC VERT 5POS 1MM SMD	13573
1-1734592-9 TE Connectivity AMP Connectors	CONN FPC BOTTOM 19POS 0.50MM R/A	0
XF3M(1)-2215-1B Omron Electronics Components	CONN FFC 22POS 1.00MM R/A	1433
66226-005LF Storage & Server IO (Amphenol ICC)	CONN FFC HEADER 5POS 2.54MM	1883
SFV6R-2STE1HLF Storage & Server IO (Amphenol ICC)	CONN FFC FPC TOP 6POS 0.50MM R/A	7848
FH26W-31S-0.3SHW(60) Hirose	CONN FPC/FFC 31POS .3MM	4182
SFV15R-2STE1HLF Storage & Server IO (Amphenol ICC)	CONN FFC TOP 15POS 0.50MM R/A	9572
046244416010846+ KYOCERA Corporation	0.5MM PITCH - 16 POS - VERTICAL	5276
5051101592 Woodhead - Molex	CONN FPC BOTTOM 15POS .5MM R/A	216
F51L-1A7H1-11008 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 1.00MM PITCH, HE	1379
046227006100829+ KYOCERA Corporation	1.0MM PITCH - 6 POS - RT ANGLE -	1692
0527932070 Woodhead - Molex	CONN FPC TOP 20POS 1.00MM R/A	1635
AYF336135A Panasonic	CONN FPC 61POS 0.30MM R/A	163
FH28D-50S-0.5SH(05) Hirose	CONN FFC BOTTOM 50POS 0.50MM R/A	0
5022313300 Woodhead - Molex	CONN FFC VERT 33POS 0.50MM SMD	1192

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities