FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
F305-1A7H1-11060-E100 Storage & Server IO (Amphenol ICC)	FLEX CONNECTOR, 0.50MM PITCH, HE	1976
0039532305 Woodhead - Molex	CONN FFC VERT 30POS 1.25MM PCB	1568
0528080471 Woodhead - Molex	CONN FFC FPC VERT 4POS 1MM SMD	1619
0541323633 Woodhead - Molex	CONN FFC BOTTOM 36POS 0.50MM R/A	7325
0522071833 Woodhead - Molex	CONN FFC FPC TOP 18POS 1MM R/A	0
ZF1-05-01-T-WT Samtec, Inc.	ZERO INSERTION FORCE 1MM ASSY	530
68711014522 Würth Elektronik Midcom	CONN FPC BOTTOM 10POS 0.50MM R/A	2750
0512811094 Woodhead - Molex	CONN FFC FPC 10POS 0.50MM R/A	25035
ZF1-20-01-T-WT-TR Samtec, Inc.	CONN FFC BOTTOM 20POS 1.00MM R/A	1895
AYF333735 Panasonic	CONN FPC 37POS 0.30MM R/A	0
2-84952-0 TE Connectivity AMP Connectors	CONN FPC BOTTOM 20POS 1.00MM R/A	5315
AYF333535 Panasonic	CONN FPC 35POS 0.30MM R/A	7622
FH40-60S-0.5SV(99) Hirose	CONN FPC VERT 60POS 0.50MM SMD	0
1-487951-2 TE Connectivity AMP Connectors	CONN FPC TOP 12POS 1.00MM R/A	0
5035662700 Woodhead - Molex	CONN FPC BOTTOM 27POS 0.30MM R/A	592
FH28-15S-0.5SH(10) Hirose	CONN FFC BOTTOM 15POS 0.50MM R/A	7704
5016165185 Woodhead - Molex	CONN FPC TOP 51POS 0.30MM R/A	1562
FH29B-34S-0.2SHW(99) Hirose	CONN FPC BOTTOM 34POS 0.20MM R/A	0
0512964094 Woodhead - Molex	CONN FFC BOTTOM 40POS 0.50MM R/A	18890
AYF533235A Panasonic	CONN FFC/FPC 32POS 0.5MM SMD R/A	3351

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities