FFC, FPC (Flat Flexible) Connectors

Part Number	Description / PDF	Quantity
SFW5R-2STE1LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC TOP 5POS 1.00MM R/A	3266
FH34SRJ-14S-0.5SH(99) Hirose	CONN FPC/FFC 14POS .5MM	3399
FH19C-9S-0.5SH(10) Hirose	CONN FFC BOTTOM 9POS 0.50MM R/A	4950
046844727002846+ KYOCERA Corporation	0.3MM PITCH - 27 POS - RT ANGLE	4996
AYF532865TA Panasonic	CONN FPC 28POS 0.5MM SMD R/A	458
0526101533 Woodhead - Molex	CONN FPC VERT 15POS 1.00MM SMD	1484
4-1775333-5 TE Connectivity AMP Connectors	CONN FPC BOTTOM 45POS 0.50MM R/A	0
0545482671 Woodhead - Molex	CONN FFC BOTTOM 26POS 0.50MM R/A	1026
ZF5S-30-01-T-WT Samtec, Inc.	CONN FFC BOTTOM 30POS 0.50MM R/A	696
SLW10R-1C7LF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 10POS 1.00MM R/A	3341
5051104591 Woodhead - Molex	CONN FFC/FPC BOTTOM 45P .5MM R/A	7888
HFW16S-2STE1LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 16POS 1MM SMD	0
SFV30R-1STE1HLF Storage & Server IO (Amphenol ICC)	CONN FFC BOTTOM 30POS 0.50MM R/A	15926
046232112015800+ KYOCERA Corporation	CONN FFC FPC VERT 12POS 1MM SMD	0
SFW10S-2STE1LF Storage & Server IO (Amphenol ICC)	CONN FFC FPC VERT 10POS 1MM SMD	1776
XF3M-1015-1B Omron Electronics Components	CONN FFC FPC 10POS 0.50MM R/A	5965
FH12-11S-0.5SH(55) Hirose	CONN FFC BOTTOM 11POS 0.50MM R/A	932
FFC3B11-30-T Global Connector Technology, Limited (GCT)	30W, 1.0MM FFC CONN, R/A,TOP CON	2769
686122188622 Würth Elektronik Midcom	WR-FPC_1.00 MM SMT HORIZONTAL LI	3000
687108183722 Würth Elektronik Midcom	CONN FFC BTM 8POS 0.5MM SMD R/A	815

FFC, FPC (Flat Flexible) Connectors

1. Overview

Flat Flexible Connectors (FFC/FPC) are compact, lightweight solutions for connecting electronic circuits. FFC (Flexible Flat Cable) refers to pre-formed ribbon cables with conductive traces, while FPC (Flexible Printed Circuit) are custom-designed circuits on flexible substrates. These connectors enable high-density interconnections in space-constrained applications, playing critical roles in modern electronics for their bendability, vibration resistance, and miniaturization capabilities.

2. Major Types & Function Classification

Type	Functional Features	Application Examples
ZIF (Zero Insertion Force)	Self-aligning contacts with minimal mating force	Smartphone displays, medical imaging devices
LIF (Low Insertion Force)	Economical solution with moderate insertion force	Consumer electronics, industrial sensors
Wrap-style FPC	360 bending capability with exposed contacts	Automotive infotainment systems
Stiffener-reinforced FFC	Localized rigidity for component mounting	Aerospace control panels

3. Structure & Composition

Typical construction includes:

Conductor Layer: Annealed copper (0.035-0.1mm thickness) with nickel/gold plating
Dielectric Layer: Polyimide film (0.05-0.25mm) or PVC insulation
Contact Interface: Phosphor bronze or beryllium copper terminals
Reinforcement: Steel/aluminum stiffeners in specific zones

Termination methods include press-fit, soldering, and anisotropic conductive film (ACF) bonding.

4. Key Technical Parameters

Parameter	Importance	Typical Range
Contact Resistance	Signal integrity maintenance	10-50m
Current Rating	Power transmission capability	0.5-3A per pin
Operating Temperature	Environmental reliability	-40 C to +105 C
Flex Life	Durability in dynamic applications	10,000-200,000 cycles
Pitch Size	Miniaturization factor	0.3mm-1.27mm

5. Application Fields

Consumer Electronics: Smartphones (camera modules), laptops (HDD connections)
Automotive: Dashboard clusters, ADAS sensors, infotainment systems
Medical: Portable monitors, imaging equipment (MRI connectors)
Industrial: Robotics (arm joint connections), measurement instruments

6. Leading Manufacturers

Manufacturer	Representative Products	Key Features
TE Connectivity	Micro Speed FFC	0.5mm pitch, 30G durability
Molex	PicoBlade FPC	Space-saving LIF design
JAE Electronics	DF12 Series	High-speed transmission up to 10Gbps
Hirose Electric	FH34 Series	Self-mating connector system

7. Selection Guidelines

Key considerations:

Circuit density requirements (pitch size vs. pin count)
Mechanical stress analysis (bend radius, flex cycles)
Thermal management needs (current load vs. conductor thickness)
Environmental sealing requirements (IP rating)
Cost vs. performance trade-offs (material choices)

Real-case Example: Smartphone camera module requires 0.3mm pitch FPC with 200 m bend radius and 100,000 flex life rating.

8. Industry Trends

Emerging developments include:

Sub-0.3mm pitch connectors for 5G mobile devices
Integrated EMI shielding in FPC structures
High-temperature resistant materials (up to 150 C)
3D-shaped FPCs for automotive LiDAR systems
Smart connectors with embedded sensing capabilities