Backplane Connectors - Specialized

Image	Part Number	Description / PDF	Quantity	Rfq
	0459844453 Woodhead - Molex	CONN RCPT LPHPOWER 32POS PCB	0
	0752354143 Woodhead - Molex	CONN HEADER GBX 80POS PCB	0
	0753414667 Woodhead - Molex	CONN HEADER POWER 8POS PCB	0
	1704753257 Woodhead - Molex	CONN HEADER IMPACT 180POS PCB	0
	0760551617 Woodhead - Molex	CONN HEADER IMPACT 240POS PCB	0
	0752354113 Woodhead - Molex	CONN HEADER GBX 80POS PCB	0
	0459858453 Woodhead - Molex	CONN PLUG LPHPOWER 36POS PCB	0
	0740589102 Woodhead - Molex	CONN HEADER VHDM 60POS PCB	0
	0461141221 Woodhead - Molex	CONN RCPT LPHPOWER 32POS PCB	0
	0459841281 Woodhead - Molex	CONN RCPT LPHPOWER 50POS PCB	0
	0736562001 Woodhead - Molex	CONN RCPT POWER 3POS PCB	0
	0876322001 Woodhead - Molex	CONN RCPT 28POS EDGE MNT	0
	0761451126 Woodhead - Molex	CONN HEADER IMPACT 180POS PCB	0
	0461144201 Woodhead - Molex	CONN RCPT LPHPOWER 24POS PCB	0
	1703401006 Woodhead - Molex	CONN RCPT IMPACT 72POS EDGE MNT	0
	0761553807 Woodhead - Molex	CONN HEADER IMPACT 96POS PCB	0
	0760559603 Woodhead - Molex	CONN HEADER IMPACT 240POS PCB	0
	0765003107 Woodhead - Molex	CONN HDR IMPACT 120POS EDGE MNT	0
	0459858271 Woodhead - Molex	CONN PLUG LPHPOWER 44POS PCB	0
	0761705120 Woodhead - Molex	CONN RCPT IMPACT 90POS EDGE MNT	0

Backplane Connectors - Specialized

1. Overview

Specialized backplane connectors are critical electromechanical components designed to establish reliable interconnections between printed circuit boards (PCBs) in complex electronic systems. These connectors enable high-speed data transmission, power distribution, and signal integrity in demanding environments. Their importance spans industries such as telecommunications, industrial automation, and aerospace, where system reliability and performance are paramount.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
High-Speed Backplane Connectors	Support data rates >25 Gbps with controlled impedance	Data center switches, 5G base stations
High-Power Backplane Connectors	Rated for >50A per contact with thermal management	Industrial motor drives, EV charging systems
High-Density Backplane Connectors	Miniaturized contacts with pitch <1.0mm	Medical imaging equipment, test instrumentation
Hermetic Backplane Connectors	IP68-rated sealing for extreme environments	Subsea sensors, military avionics

3. Structure and Components

Typical construction includes: - Contact Pins: Phosphor bronze or beryllium copper with gold plating - Insulation Housing: LCP (Liquid Crystal Polymer) or PPS (Polyphenylene Sulfide) - Shielding: 360 EMI protection with stainless steel springs - Retention Mechanism: Polarized keying and threaded inserts - Thermal Management: Integrated heat dissipation fins

4. Key Technical Specifications

Parameter	Typical Range	Importance
Current Rating	1-100A	Power transmission capability
Contact Resistance	0.5-5m	Signal integrity maintenance
Dielectric Withstanding Voltage	500V-5kV	Electrical safety assurance
Operating Temperature	-55 C to +125 C	Environmental reliability
Mating Cycles	500-20,000	Long-term durability

5. Application Fields

Telecommunications: 5G NR base stations, optical transport networks
Industrial: Programmable logic controllers (PLCs), robotics
Medical: MRI scanners, digital radiography systems
Transportation: Railway signaling systems, EV powertrains

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Feature
TE Connectivity	Hypertac Backplane	100Gbps data rate with floating contact design
Amphenol	Rosenberger 400Gbps	Modular architecture for scalable networks
Molex	Impel High-Speed	Differential pair shielding for signal integrity

7. Selection Guidelines

Evaluate system bandwidth requirements (e.g., PCIe 5.0 needs 32 GT/s)
Verify vibration/thermal cycling compliance (e.g., Telcordia GR-63-CORE)
Assess PCB footprint compatibility (e.g., orthogonal vs. parallel mounting)
Confirm RoHS/REACH compliance for regulatory requirements
Balance cost vs. expected product lifecycle (5-15 years typical)

8. Industry Trends

Key developments include: - Transition to 112 Gbps PAM4 signaling for next-gen data centers - Integration of optical interfaces in hybrid electro-optical connectors - Adoption of advanced plating materials (e.g., nano-coated gold alloys) - Growing demand for circular (360 ) interconnect solutions - Implementation of AI-driven predictive maintenance features in connectors