ample-chip ample-chip
RFQ
BOM

Backplane Connectors - Specialized

Image Part Number Description / PDF Quantity Rfq
0736420000

0736420000

Woodhead - Molex

CONN HEADER HDM 72POS PCB

0
0459854413

0459854413

Woodhead - Molex

CONN PLUG LPHPOWER 16POS PCB

114
0761703036

0761703036

Woodhead - Molex

CONN RCPT IMPACT 54POS EDGE MNT

1004
0459848131

0459848131

Woodhead - Molex

CONN RCPT LPHPOWER 28POS PCB

95
0761551808

0761551808

Woodhead - Molex

CONN HEADER IMPACT 96POS PCB

385
0461144121

0461144121

Woodhead - Molex

CONN RCPT LPHPOWER 16POS PCB

121
0761701010

0761701010

Woodhead - Molex

CONN RCPT IMPACT 90POS EDGE MNT

171
1705251837

1705251837

Woodhead - Molex

CONN HEADER IMPACT 72POS PCB

0
0761551113

0761551113

Woodhead - Molex

CONN HEADER IMPACT 120POS PCB

0
0461141229

0461141229

Woodhead - Molex

CONN RCPT LPHPOWER 40POS PCB

0
0761451114

0761451114

Woodhead - Molex

CONN HEADER IMPACT 180POS PCB

0
0736420100

0736420100

Woodhead - Molex

CONN HEADER HDM 72POS PCB

0
0782151022

0782151022

Woodhead - Molex

CONN HEADER POWER 4POS EDGE MNT

0
0764503608

0764503608

Woodhead - Molex

CONN HDR IMPACT 96POS EDGE MNT

0
0761555608

0761555608

Woodhead - Molex

CONN HEADER IMPACT 192POS PCB

0
0782342001

0782342001

Woodhead - Molex

CONN HEADER I-TRAC 2POS EDGE MNT

0
0752352758

0752352758

Woodhead - Molex

CONN HEADER GBX 56POS PCB

0
0761505326

0761505326

Woodhead - Molex

CONN RCPT IMPACT 288POS EDGE MNT

0
0461130323

0461130323

Woodhead - Molex

CONN RCPT LPHPOWER 32POS PCB

0
0461148321

0461148321

Woodhead - Molex

CONN RCPT LPHPOWER 40POS PCB

0

Backplane Connectors - Specialized

1. Overview

Specialized backplane connectors are critical electromechanical components designed to establish reliable interconnections between printed circuit boards (PCBs) in complex electronic systems. These connectors enable high-speed data transmission, power distribution, and signal integrity in demanding environments. Their importance spans industries such as telecommunications, industrial automation, and aerospace, where system reliability and performance are paramount.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
High-Speed Backplane ConnectorsSupport data rates >25 Gbps with controlled impedanceData center switches, 5G base stations
High-Power Backplane ConnectorsRated for >50A per contact with thermal managementIndustrial motor drives, EV charging systems
High-Density Backplane ConnectorsMiniaturized contacts with pitch <1.0mmMedical imaging equipment, test instrumentation
Hermetic Backplane ConnectorsIP68-rated sealing for extreme environmentsSubsea sensors, military avionics

3. Structure and Components

Typical construction includes: - Contact Pins: Phosphor bronze or beryllium copper with gold plating - Insulation Housing: LCP (Liquid Crystal Polymer) or PPS (Polyphenylene Sulfide) - Shielding: 360 EMI protection with stainless steel springs - Retention Mechanism: Polarized keying and threaded inserts - Thermal Management: Integrated heat dissipation fins

4. Key Technical Specifications

ParameterTypical RangeImportance
Current Rating1-100APower transmission capability
Contact Resistance0.5-5m Signal integrity maintenance
Dielectric Withstanding Voltage500V-5kVElectrical safety assurance
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500-20,000Long-term durability

5. Application Fields

  • Telecommunications: 5G NR base stations, optical transport networks
  • Industrial: Programmable logic controllers (PLCs), robotics
  • Medical: MRI scanners, digital radiography systems
  • Transportation: Railway signaling systems, EV powertrains

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Feature
TE ConnectivityHypertac Backplane100Gbps data rate with floating contact design
AmphenolRosenberger 400GbpsModular architecture for scalable networks
MolexImpel High-SpeedDifferential pair shielding for signal integrity

7. Selection Guidelines

  1. Evaluate system bandwidth requirements (e.g., PCIe 5.0 needs 32 GT/s)
  2. Verify vibration/thermal cycling compliance (e.g., Telcordia GR-63-CORE)
  3. Assess PCB footprint compatibility (e.g., orthogonal vs. parallel mounting)
  4. Confirm RoHS/REACH compliance for regulatory requirements
  5. Balance cost vs. expected product lifecycle (5-15 years typical)

8. Industry Trends

Key developments include: - Transition to 112 Gbps PAM4 signaling for next-gen data centers - Integration of optical interfaces in hybrid electro-optical connectors - Adoption of advanced plating materials (e.g., nano-coated gold alloys) - Growing demand for circular (360 ) interconnect solutions - Implementation of AI-driven predictive maintenance features in connectors

RFQ BOM Call Skype Email
Top