Backplane Connectors - Specialized

Part Number	Description / PDF	Quantity
0768503038 Woodhead - Molex	CONN RCPT IMPACT 96POS EDGE MNT	132
0459854411 Woodhead - Molex	CONN PLUG LPHPOWER 16POS PCB	524
0757053103 Woodhead - Molex	CONN HEADER I-TRAC 220POS PCB	961632
1060880100 Woodhead - Molex	MPO MIDPLANE CONNECTOR	6
0736560000 Woodhead - Molex	CONN RCPT HDM 3POS PCB	0
0782181001 Woodhead - Molex	CONN RCPT POWER 6POS PCB	391
0464373003 Woodhead - Molex	CONN PLUG TEN60 28POS PCB	0
1727301138 Woodhead - Molex	CONN RCPT IMPEL 48POS PCB	152
0764603020 Woodhead - Molex	CONN RCPT IMPACT 60POS EDGE MNT	480
0459844482 Woodhead - Molex	CONN RCPT LPHPOWER 44POS PCB	17
0757101008 Woodhead - Molex	CONN RCPT I-TRAC 176POS EDGE MNT	59
0459854422 Woodhead - Molex	CONN PLUG LPHPOWER 20POS PCB	133
0461148241 Woodhead - Molex	CONN RCPT LPHPOWER 32POS PCB	0
1714001026 Woodhead - Molex	CONN RCPT IMPEL 192POS PCB	173
0760203004 Woodhead - Molex	CONN RCPT I-TRAC 56POS EDGE MNT	73
0764101107 Woodhead - Molex	CONN HDR IMPACT 90POS EDGE MNT	512
0459840007 Woodhead - Molex	CONN RCPT LPHPOWER 26POS PCB	1349
0767619001 Woodhead - Molex	CONN HEADER VHDM 60POS PCB	0
1724530412 Woodhead - Molex	CONN PLUG TEN60 16POS PCB	27
0740571009 Woodhead - Molex	CONN HEADER VHDM 60POS PCB	0

Backplane Connectors - Specialized

1. Overview

Specialized backplane connectors are critical electromechanical components designed to establish reliable interconnections between printed circuit boards (PCBs) in complex electronic systems. These connectors enable high-speed data transmission, power distribution, and signal integrity in demanding environments. Their importance spans industries such as telecommunications, industrial automation, and aerospace, where system reliability and performance are paramount.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
High-Speed Backplane Connectors	Support data rates >25 Gbps with controlled impedance	Data center switches, 5G base stations
High-Power Backplane Connectors	Rated for >50A per contact with thermal management	Industrial motor drives, EV charging systems
High-Density Backplane Connectors	Miniaturized contacts with pitch <1.0mm	Medical imaging equipment, test instrumentation
Hermetic Backplane Connectors	IP68-rated sealing for extreme environments	Subsea sensors, military avionics

3. Structure and Components

Typical construction includes: - Contact Pins: Phosphor bronze or beryllium copper with gold plating - Insulation Housing: LCP (Liquid Crystal Polymer) or PPS (Polyphenylene Sulfide) - Shielding: 360 EMI protection with stainless steel springs - Retention Mechanism: Polarized keying and threaded inserts - Thermal Management: Integrated heat dissipation fins

4. Key Technical Specifications

Parameter	Typical Range	Importance
Current Rating	1-100A	Power transmission capability
Contact Resistance	0.5-5m	Signal integrity maintenance
Dielectric Withstanding Voltage	500V-5kV	Electrical safety assurance
Operating Temperature	-55 C to +125 C	Environmental reliability
Mating Cycles	500-20,000	Long-term durability

5. Application Fields

Telecommunications: 5G NR base stations, optical transport networks
Industrial: Programmable logic controllers (PLCs), robotics
Medical: MRI scanners, digital radiography systems
Transportation: Railway signaling systems, EV powertrains

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Feature
TE Connectivity	Hypertac Backplane	100Gbps data rate with floating contact design
Amphenol	Rosenberger 400Gbps	Modular architecture for scalable networks
Molex	Impel High-Speed	Differential pair shielding for signal integrity

7. Selection Guidelines

Evaluate system bandwidth requirements (e.g., PCIe 5.0 needs 32 GT/s)
Verify vibration/thermal cycling compliance (e.g., Telcordia GR-63-CORE)
Assess PCB footprint compatibility (e.g., orthogonal vs. parallel mounting)
Confirm RoHS/REACH compliance for regulatory requirements
Balance cost vs. expected product lifecycle (5-15 years typical)

8. Industry Trends

Key developments include: - Transition to 112 Gbps PAM4 signaling for next-gen data centers - Integration of optical interfaces in hybrid electro-optical connectors - Adoption of advanced plating materials (e.g., nano-coated gold alloys) - Growing demand for circular (360 ) interconnect solutions - Implementation of AI-driven predictive maintenance features in connectors