Backplane Connectors - Specialized

Image Part Number Description / PDF Quantity Rfq
0752354209

0752354209

Woodhead - Molex

CONN HEADER GBX 200POS PCB

0

0737801255

0737801255

Woodhead - Molex

CONN RCPT HDM 144POS PCB

1650

0768457805

0768457805

Woodhead - Molex

CONN HEADER IMPACT 96POS PCB

0

0758481205

0758481205

Woodhead - Molex

CONN HEADER GBX 250POS PCB

0

0459841441

0459841441

Woodhead - Molex

CONN RCPT LPHPOWER 34POS PCB

0

0782291003

0782291003

Woodhead - Molex

CONN HEADER I-TRAC 2POS EDGE MNT

0

0752374205

0752374205

Woodhead - Molex

CONN HEADER GBX 250POS PCB

0

0752352135

0752352135

Woodhead - Molex

CONN HEADER GBX 80POS PCB

0

1703351407

1703351407

Woodhead - Molex

CONN HEADER IMPACT 168POS PCB

0

0752374113

0752374113

Woodhead - Molex

CONN HEADER GBX 100POS PCB

0

0753414644

0753414644

Woodhead - Molex

CONN HEADER POWER 8POS PCB

0

0737803243

0737803243

Woodhead - Molex

CONN RCPT HDM 144POS PCB

0

0736440206

0736440206

Woodhead - Molex

CONN HEADER HDM 72POS PCB

0

0465621127

0465621127

Woodhead - Molex

CONN RCPT TEN60 7POS PCB

0

0752354139

0752354139

Woodhead - Molex

CONN HEADER GBX 80POS PCB

0

0459856932

0459856932

Woodhead - Molex

CONN PLUG LPHPOWER 6POS PCB

0

0459851373

0459851373

Woodhead - Molex

CONN PLUG LPHPOWER 46POS PCB

0

0760290007

0760290007

Woodhead - Molex

I-TRAC 7 X10 CUSTOM BP ASSY

0

0752354207

0752354207

Woodhead - Molex

CONN HEADER GBX 200POS PCB

0

0753310777

0753310777

Woodhead - Molex

CONN HEADER POWER 6POS PCB

0

Backplane Connectors - Specialized

1. Overview

Specialized backplane connectors are critical electromechanical components designed to establish reliable interconnections between printed circuit boards (PCBs) in complex electronic systems. These connectors enable high-speed data transmission, power distribution, and signal integrity in demanding environments. Their importance spans industries such as telecommunications, industrial automation, and aerospace, where system reliability and performance are paramount.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
High-Speed Backplane ConnectorsSupport data rates >25 Gbps with controlled impedanceData center switches, 5G base stations
High-Power Backplane ConnectorsRated for >50A per contact with thermal managementIndustrial motor drives, EV charging systems
High-Density Backplane ConnectorsMiniaturized contacts with pitch <1.0mmMedical imaging equipment, test instrumentation
Hermetic Backplane ConnectorsIP68-rated sealing for extreme environmentsSubsea sensors, military avionics

3. Structure and Components

Typical construction includes: - Contact Pins: Phosphor bronze or beryllium copper with gold plating - Insulation Housing: LCP (Liquid Crystal Polymer) or PPS (Polyphenylene Sulfide) - Shielding: 360 EMI protection with stainless steel springs - Retention Mechanism: Polarized keying and threaded inserts - Thermal Management: Integrated heat dissipation fins

4. Key Technical Specifications

ParameterTypical RangeImportance
Current Rating1-100APower transmission capability
Contact Resistance0.5-5m Signal integrity maintenance
Dielectric Withstanding Voltage500V-5kVElectrical safety assurance
Operating Temperature-55 C to +125 CEnvironmental reliability
Mating Cycles500-20,000Long-term durability

5. Application Fields

  • Telecommunications: 5G NR base stations, optical transport networks
  • Industrial: Programmable logic controllers (PLCs), robotics
  • Medical: MRI scanners, digital radiography systems
  • Transportation: Railway signaling systems, EV powertrains

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Feature
TE ConnectivityHypertac Backplane100Gbps data rate with floating contact design
AmphenolRosenberger 400GbpsModular architecture for scalable networks
MolexImpel High-SpeedDifferential pair shielding for signal integrity

7. Selection Guidelines

  1. Evaluate system bandwidth requirements (e.g., PCIe 5.0 needs 32 GT/s)
  2. Verify vibration/thermal cycling compliance (e.g., Telcordia GR-63-CORE)
  3. Assess PCB footprint compatibility (e.g., orthogonal vs. parallel mounting)
  4. Confirm RoHS/REACH compliance for regulatory requirements
  5. Balance cost vs. expected product lifecycle (5-15 years typical)

8. Industry Trends

Key developments include: - Transition to 112 Gbps PAM4 signaling for next-gen data centers - Integration of optical interfaces in hybrid electro-optical connectors - Adoption of advanced plating materials (e.g., nano-coated gold alloys) - Growing demand for circular (360 ) interconnect solutions - Implementation of AI-driven predictive maintenance features in connectors

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